发明申请
- 专利标题: VACUUM FILM-FORMING APPARATUS
- 专利标题(中): 真空成膜装置
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申请号: US12111698申请日: 2008-04-29
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公开(公告)号: US20080202423A1公开(公告)日: 2008-08-28
- 发明人: Masanobu HATANAKA , Michio Ishikawa , Se-Ju Lim , Fumio Nakamura
- 申请人: Masanobu HATANAKA , Michio Ishikawa , Se-Ju Lim , Fumio Nakamura
- 专利权人: ULVAC, INC.
- 当前专利权人: ULVAC, INC.
- 优先权: JP151615/2004 20040521; JP130851/2005 20050428
- 主分类号: C23C16/50
- IPC分类号: C23C16/50
摘要:
A vacuum film-forming apparatus comprising substrate stages; vacuum chamber-forming containers opposed to the stages; a means for moving the substrate between the stages; and gas-introduction means connected to every containers, wherein one of the stage and the container is ascended or descended towards the other to bring the upper face of the stage and the opening of the container into contact with one another so that vacuum chambers can be formed and that a raw gas and/or a reactant gas can be introduced into each space of the chamber through each gas-introduction means to carry out either the adsorption or reaction step for allowing the raw gas to react with the reactant gas. The apparatus permits the independent establishment of process conditions for the adsorption and reaction processes and the better acceleration of the reaction between raw and reactant gases to give a film having excellent quality and the apparatus can be manufactured at a low cost.
公开/授权文献
- US07828900B2 Vacuum film-forming apparatus 公开/授权日:2010-11-09
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