Invention Application
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US11984738Application Date: 2007-11-21
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Publication No.: US20080203475A1Publication Date: 2008-08-28
- Inventor: Takashi Saiki , Hiroyuki Ohta , Hiroyuki Kanata
- Applicant: Takashi Saiki , Hiroyuki Ohta , Hiroyuki Kanata
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Priority: JP2003-373499 20031031
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
An extension region is formed by ion implantation under masking by a gate electrode, and then a substance having a diffusion suppressive function over an impurity contained in a source-and-drain is implanted under masking by the gate electrode and a first sidewall spacer so as to form amorphous layers a semiconductor substrate within a surficial layer thereof and in alignment with the first sidewall spacer, to thereby form an amorphous diffusion suppressive region.
Public/Granted literature
- US07663187B2 Semiconductor device and method of fabricating the same Public/Granted day:2010-02-16
Information query
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