发明申请
- 专利标题： Component, Power Component, Apparatus, Method Of Manufacturing A Component, And Method Of Manufacturing A Power Semiconductor Component
- 专利标题（中）： 元件，功率元件，器件，制造元件的方法和制造功率半导体元件的方法
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申请号： US11685321申请日： 2007-03-13
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公开(公告)号： US20080203550A1公开(公告)日： 2008-08-28
- 发明人: Henrik Ewe , Joachim Mahler
- 申请人： Henrik Ewe , Joachim Mahler
- 优先权： DE102007009521.1 20070227
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A component has a device applied to a device carrier, a first conducting layer grown onto the device and onto the device carrier, and an insulating material applied to the first conducting layer such that only a portion of the first conducting layer is covered.
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