发明申请
- 专利标题： INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
- 专利标题（中）： 使用无铅焊盘和具有反应障碍层的片芯互连
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申请号： US12113152申请日： 2008-04-30
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公开(公告)号： US20080206979A1公开(公告)日： 2008-08-28
- 发明人: Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye , Da-Yuan Shih , Donna S. Zupanski-Nielsen
- 申请人： Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye , Da-Yuan Shih , Donna S. Zupanski-Nielsen
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
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