发明申请
- 专利标题： LOW-PROFILE CAPILLARY FOR WIRE BONDING
- 专利标题（中）： 用于电线连接的低轮廓毛细管
-
申请号： US11839198申请日： 2007-08-15
-
公开(公告)号： US20080210740A1公开(公告)日： 2008-09-04
- 发明人: James E. Eder , Jon Brunner
- 申请人： James E. Eder , Jon Brunner
- 申请人地址： US PA Fort Washington
- 专利权人： KULICKE AND SOFFA INDUSTRIES, INC.
- 当前专利权人： KULICKE AND SOFFA INDUSTRIES, INC.
- 当前专利权人地址： US PA Fort Washington
- 主分类号： B23K20/10
- IPC分类号： B23K20/10
摘要：
A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
公开/授权文献
- US07500591B2 Low-profile capillary for wire bonding 公开/授权日：2009-03-10
信息查询
