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公开(公告)号:US20060186179A1
公开(公告)日:2006-08-24
申请号:US11064283
申请日:2005-02-23
申请人: Lee Levine , Matthew Osborne , Stephen Babinetz , Jon Brunner
发明人: Lee Levine , Matthew Osborne , Stephen Babinetz , Jon Brunner
IPC分类号: B23K31/02
CPC分类号: H01L24/85 , B23K20/007 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/04042 , H01L2224/05009 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/4554 , H01L2224/45669 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48847 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/05042 , H01L2924/14 , H01L2924/30105 , H01L2924/00 , H01L2224/48824
摘要: A wire bonder and a method of bonding a bonding wire to a bonding pad of a bonding location using the wire bonder are provided. The method includes forming a bonding ball at an end of the bonding wire, pre-deforming at least a portion of the bonding ball and bonding the pre-deformed ball to the bonding pad. The wire bonder includes a source of heat disposed adjacent a bonding tool to melt a portion of the bonding wire to produce the bonding ball at an end thereof, and a pre-deforming unit including a deforming surface to pre-deform at least a portion of the bonding ball.
摘要翻译: 提供了一种引线接合器和使用引线接合器将接合线接合到接合位置的接合焊盘的方法。 该方法包括在接合线的端部形成接合球,对接合球的至少一部分进行预变形,并将预变形的球接合到接合焊盘。 引线接合器包括邻近焊接工具设置的熔化源,以熔化接合线的一部分以在其一端产生接合球;以及预变形单元,其包括变形表面以预变形至少一部分 粘接球。
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公开(公告)号:US20060076337A1
公开(公告)日:2006-04-13
申请号:US11053499
申请日:2005-02-08
申请人: Jon Brunner , Horst Clauberg , John Shuhart
发明人: Jon Brunner , Horst Clauberg , John Shuhart
IPC分类号: B23K35/04
CPC分类号: B23K35/02 , B23K35/0205 , B23K35/222 , C22C5/04 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45144 , H01L2224/45169 , H01L2224/45178 , H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/78301 , H01L2224/85013 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01028 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/2076
摘要: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
摘要翻译: 提供了一种用于引线接合装置的电极。 电极包括主体部分和与主体部分相邻的尖端部分。 尖端部分具有基本上球形的构造。
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公开(公告)号:US07004369B2
公开(公告)日:2006-02-28
申请号:US11037431
申请日:2005-01-18
申请人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
发明人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
CPC分类号: H01L24/85 , B23K20/004 , B23K20/007 , B23K2101/32 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48451 , H01L2224/78302 , H01L2224/85201 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/00015
摘要: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
摘要翻译: 公开了一种用于将细线接合到具有非常细间距的接合焊盘的接合工具。 接合工具在其末端包括工作尖端。 工作尖端包括形成在工作尖端的端部的内部的环形倒角,内环形倒角具有小于约60度的角度。 内环形倒角联接到形成在接合工具中的圆柱形通道的下部。
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公开(公告)号:US07795557B2
公开(公告)日:2010-09-14
申请号:US12114200
申请日:2008-05-02
申请人: Jon Brunner , Horst Clauberg , John Shuhart
发明人: Jon Brunner , Horst Clauberg , John Shuhart
CPC分类号: B23K35/02 , B23K35/0205 , B23K35/222 , C22C5/04 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45144 , H01L2224/45169 , H01L2224/45178 , H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/78301 , H01L2224/85013 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01028 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/2076
摘要: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
摘要翻译: 提供了一种用于引线接合装置的电极。 电极包括主体部分和与主体部分相邻的尖端部分。 尖端部分具有基本上球形的构造。
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公开(公告)号:US07411157B2
公开(公告)日:2008-08-12
申请号:US11053499
申请日:2005-02-08
申请人: Jon Brunner , Horst Clauberg , John Shuhart
发明人: Jon Brunner , Horst Clauberg , John Shuhart
IPC分类号: B23K35/04
CPC分类号: B23K35/02 , B23K35/0205 , B23K35/222 , C22C5/04 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45144 , H01L2224/45169 , H01L2224/45178 , H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/78301 , H01L2224/85013 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01028 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/2076
摘要: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
摘要翻译: 提供了一种用于引线接合装置的电极。 电极包括主体部分和与主体部分相邻的尖端部分。 尖端部分具有基本上球形的构造。
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公开(公告)号:US20050252950A1
公开(公告)日:2005-11-17
申请号:US11122939
申请日:2005-05-05
申请人: James Eder , Jon Brunner
发明人: James Eder , Jon Brunner
CPC分类号: B23K20/007 , B23K20/004 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/78268 , H01L2224/78301 , H01L2224/78302 , H01L2224/85045 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
摘要翻译: 引线接合工具包括具有第一外径的第一圆柱形部分和与第一圆柱形部分相邻的第二圆柱形部分。 第二圆筒部具有第二外径,第二外径小于第一外径。 引线接合工具还包括与第二圆柱形部分相邻的锥形部分。 锥形部在与第二圆筒部相邻的一端具有第三外径,第三外径小于第一外径。
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公开(公告)号:US20050121494A1
公开(公告)日:2005-06-09
申请号:US11037431
申请日:2005-01-18
申请人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
发明人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
IPC分类号: H01L21/60 , B23K20/00 , B23K31/02 , H01L21/603
CPC分类号: H01L24/85 , B23K20/004 , B23K20/007 , B23K2101/32 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48451 , H01L2224/78302 , H01L2224/85201 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/00015
摘要: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
摘要翻译: 公开了一种用于将细线接合到具有非常细间距的接合焊盘的接合工具。 接合工具在其末端包括工作尖端。 工作尖端包括形成在工作尖端的端部的内部的环形倒角,内环形倒角具有小于约60度的角度。 内环形倒角联接到形成在接合工具中的圆柱形通道的下部。
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公开(公告)号:US20080210740A1
公开(公告)日:2008-09-04
申请号:US11839198
申请日:2007-08-15
申请人: James E. Eder , Jon Brunner
发明人: James E. Eder , Jon Brunner
IPC分类号: B23K20/10
CPC分类号: B23K20/007 , B23K20/004 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/78268 , H01L2224/78301 , H01L2224/78302 , H01L2224/85045 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
摘要翻译: 引线接合工具包括具有第一外径的第一圆柱形部分和与第一圆柱形部分相邻的第二圆柱形部分。 第二圆筒部具有第二外径,第二外径小于第一外径。 引线接合工具还包括与第二圆柱形部分相邻的锥形部分。 锥形部在与第二圆筒部相邻的一端具有第三外径,第三外径小于第一外径。
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公开(公告)号:US06910612B2
公开(公告)日:2005-06-28
申请号:US10639302
申请日:2003-08-12
申请人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
发明人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
CPC分类号: H01L24/85 , B23K20/004 , B23K20/007 , B23K2101/32 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48451 , H01L2224/78302 , H01L2224/85201 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/00015
摘要: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
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公开(公告)号:US20080264907A1
公开(公告)日:2008-10-30
申请号:US12114200
申请日:2008-05-02
申请人: Jon Brunner , Horst Clauberg , John Shuhart
发明人: Jon Brunner , Horst Clauberg , John Shuhart
CPC分类号: B23K35/02 , B23K35/0205 , B23K35/222 , C22C5/04 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45144 , H01L2224/45169 , H01L2224/45178 , H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/78301 , H01L2224/85013 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01028 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/2076
摘要: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
摘要翻译: 提供了一种用于引线接合装置的电极。 电极包括主体部分和与主体部分相邻的尖端部分。 尖端部分具有基本上球形的构造。
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