发明申请
- 专利标题： Method of forming plugs
- 专利标题（中）： 形成插头的方法
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申请号： US11713038申请日： 2007-03-02
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公开(公告)号： US20080213991A1公开(公告)日： 2008-09-04
- 发明人: Wen-Jiunn Tsay , Bao-Tai Hwang , David Yow-Chern Chang , Ling-Haur Huang
- 申请人： Wen-Jiunn Tsay , Bao-Tai Hwang , David Yow-Chern Chang , Ling-Haur Huang
- 专利权人： AirDio Wireless Inc.
- 当前专利权人： AirDio Wireless Inc.
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
The present invention is a method of forming plugs for engaging with a socket on a substrate having pads thereon. The method including the steps of forming an insulation layer on the substrate, patterning the insulation layer to form openings for exposing the pads by a wet etching, respectively, forming conductive plugs in the openings to electrically connect with the pads, and partially removing the insulation layer.
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