发明申请
US20080214062A1 Telecommunications Module and a Method of Manufacturing the Same 审中-公开
电信模块及其制造方法

  • 专利标题: Telecommunications Module and a Method of Manufacturing the Same
  • 专利标题(中): 电信模块及其制造方法
  • 申请号: US11908523
    申请日: 2006-03-20
  • 公开(公告)号: US20080214062A1
    公开(公告)日: 2008-09-04
  • 发明人: Friedrich W. Denter
  • 申请人: Friedrich W. Denter
  • 优先权: EP05006094.6 20050321
  • 国际申请: PCT/US06/10253 WO 20060320
  • 主分类号: H01R13/24
  • IPC分类号: H01R13/24 H01R43/20
Telecommunications Module and a Method of Manufacturing the Same
摘要:
A telecommunications module (10) has at least one contact element (12) and a housing (14), into which the contact element (12) is inserted, wherein the housing (14) comprises at least one first guide (16) with which at least a portion of the contact element (12) comes in contact during insertion thereof, so as to deflect at least a portion of the contact element (12).
信息查询
0/0