发明申请
US20080217780A1 ELIMINATING METAL-RICH SILICIDES USING AN AMORPHOUS Ni ALLOY SILICIDE STRUCTURE
有权
使用非晶态Ni合金硅氧烷结构消除金属硅氧烷
- 专利标题: ELIMINATING METAL-RICH SILICIDES USING AN AMORPHOUS Ni ALLOY SILICIDE STRUCTURE
- 专利标题(中): 使用非晶态Ni合金硅氧烷结构消除金属硅氧烷
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申请号: US12105034申请日: 2008-04-17
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公开(公告)号: US20080217780A1公开(公告)日: 2008-09-11
- 发明人: Christophe Detavernier , Simon Gaudet , Christian Lavoie , Conal E. Murray
- 申请人: Christophe Detavernier , Simon Gaudet , Christian Lavoie , Conal E. Murray
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L23/498
- IPC分类号: H01L23/498
摘要:
The present invention provides a method for producing thin nickel (Ni) monosilicide or NiSi films (having a thickness on the order of about 30 nm or less), as contacts in CMOS devices wherein an amorphous Ni alloy silicide layer is formed during annealing which eliminates (i.e., completely by-passing) the formation of metal-rich silicide layers. By eliminating the formation of the metal-rich silicide layers, the resultant NiSi film formed has improved surface roughness as compared to a NiSi film formed from a metal-rich silicide phase. The method of the present invention also forms Ni monosilicide films without experiencing any dependence of the dopant type concentration within the Si-containing substrate that exists with the prior art NiSi films.
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