发明申请
US20080227226A1 Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device 审中-公开
半导体衬底,半导体器件的制造方法和半导体器件的测试方法

Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device
摘要:
A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
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