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1.发明申请Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device 审中-公开半导体衬底，半导体器件的制造方法和半导体器件的测试方法公开(公告)号：US20060097356A1
公开(公告)日：2006-05-11
申请号：US11062488
申请日：2005-02-23
IPC分类号： H01L23/544
CPC分类号： H01L21/78 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
摘要翻译： 半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。 多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。 第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。 第二划线在单元曝光和打印区域之间延伸。 第一划线的宽度与第二划线的宽度不同。
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2.发明申请Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device 审中-公开半导体衬底，半导体器件的制造方法和半导体器件的测试方法公开(公告)号：US20080227226A1
公开(公告)日：2008-09-18
申请号：US12153481
申请日：2008-05-20
IPC分类号： H01L21/66 , H01L21/304
CPC分类号： H01L21/78 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
摘要翻译： 半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。 多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。 第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。 第二划线在单元曝光和打印区域之间延伸。 第一划线的宽度与第二划线的宽度不同。
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公开(公告)号：US20060220667A1
公开(公告)日：2006-10-05
申请号：US11211094
申请日：2005-08-25
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： A testing device can perform a test on an arbitrary one of a plurality of semiconductor devices by pressing the semiconductor devices onto a contactor from a back side of the semiconductor device. A test circuit board has a contactor provided with contact pieces corresponding to external connection terminals of semiconductor devices to be tested. A support board is capable of mounting the semiconductor devices thereon in an aligned state. A stage supports the support board. A press head presses the semiconductor devices to be tested mounted on the support board so as to cause external connection terminals of the semiconductor devices to be tested to contact with the contact pieces of the contactor. The stage is movable to a position at which at least one of the semiconductor devices to be tested, which are mounted on the support board, faces the contactor.
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公开(公告)号：US07129726B2
公开(公告)日：2006-10-31
申请号：US11211094
申请日：2005-08-25
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： A testing device can perform a test on an arbitrary one of a plurality of semiconductor devices by pressing the semiconductor devices onto a contactor from a back side of the semiconductor device. A test circuit board has a contactor provided with contact pieces corresponding to external connection terminals of semiconductor devices to be tested. A support board is capable of mounting the semiconductor devices thereon in an aligned state. A stage supports the support board. A press head presses the semiconductor devices to be tested mounted on the support board so as to cause external connection terminals of the semiconductor devices to be tested to contact with the contact pieces of the contactor. The stage is movable to a position at which at least one of the semiconductor devices to be tested, which are mounted on the support board, faces the contactor.
摘要翻译： 测试装置可以通过将半导体器件从半导体器件的背面按压到接触器上来对多个半导体器件中的任意一个进行测试。 测试电路板具有接触器，该接触器具有与待测试的半导体器件的外部连接端子相对应的接触片。 支撑板能够以对准状态将半导体器件安装在其上。 舞台支持支持板。 压头按压待安装在支撑板上的待测试的半导体器件，以便使半导体器件的外部连接端子被测试以与接触器的接触片接触。 舞台可移动到安装在支撑板上的要测试的半导体器件中的至少一个面向接触器的位置。
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5.发明申请Semiconductor apparatus testing arrangement and semiconductor apparatus testing method 有权半导体装置测试装置和半导体装置测试方法公开(公告)号：US20070096761A1
公开(公告)日：2007-05-03
申请号：US11339826
申请日：2006-01-26
申请人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
发明人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
IPC分类号： G01R31/26
CPC分类号： G01R1/0433
摘要： A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
摘要翻译： 一种用于测试在半导体衬底上制造的多个半导体器件的半导体器件测试装置，具有布置有多个测试单元的衬底，每个单元包括与半导体器件的电极端子相对应的探针和连接的导体部件 用探针。
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6.发明授权Semiconductor apparatus testing arrangement and semiconductor apparatus testing method 有权半导体装置测试装置和半导体装置测试方法公开(公告)号：US07355421B2
公开(公告)日：2008-04-08
申请号：US11339826
申请日：2006-01-26
申请人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
发明人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
CPC分类号： G01R1/0433
摘要： A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
摘要翻译： 一种用于测试在半导体衬底上制造的多个半导体器件的半导体器件测试装置，具有布置有多个测试单元的衬底，每个单元包括与半导体器件的电极端子相对应的探针和连接的导体部件 用探针。
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公开(公告)号：US20060186905A1
公开(公告)日：2006-08-24
申请号：US11339836
申请日：2006-01-26
IPC分类号： G01R31/02
CPC分类号： G01R1/0466 , G01R1/0483
摘要： A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.
摘要翻译： 用于电子部件的接触器可以提供相对于诸如IC的电子部件中的多个电极端子的适当且均匀的接触。 多个接触构件中的每一个在其一端具有第一接触部分和另一端的第二接触部分，第一接合部分具有容纳电子部件的电极端子之一的凹部。 基座容纳并支撑多个接触构件。 第一接触部分可沿水平方向移动。
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公开(公告)号：US07471096B2
公开(公告)日：2008-12-30
申请号：US11339836
申请日：2006-01-26
IPC分类号： G01R31/02
CPC分类号： G01R1/0466 , G01R1/0483
摘要： A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.
摘要翻译： 用于电子部件的接触器可以提供相对于诸如IC的电子部件中的多个电极端子的适当且均匀的接触。 多个接触构件中的每一个在其一端具有第一接触部分和另一端的第二接触部分，第一接合部分具有容纳电子部件的电极端子之一的凹部。 基座容纳并支撑多个接触构件。 第一接触部分可沿水平方向移动。
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公开(公告)号：US07180312B2
公开(公告)日：2007-02-20
申请号：US10395208
申请日：2003-03-25
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/07342 , H01L2924/0002 , H01L2924/00
摘要： A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.
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公开(公告)号：US20070170937A1
公开(公告)日：2007-07-26
申请号：US11408158
申请日：2006-04-21
IPC分类号： G01R31/02
CPC分类号： G01R31/2891
摘要： An evaluation method of a probe mark of a probe needle of a probe card, includes the steps of: forming the probe mark of the probe needle on a probe mark evaluation wafer; recognizing the probe mark with imaging; and overlapping an imaginary electrode pad with the probe mark recognized by imaging so that the probe mark is evaluated.
摘要翻译： 探针卡的探针的探针的评价方法包括以下步骤：在探针标记评价用晶片上形成探针的探针标记; 用成像识别探针标记; 并且与通过成像识别的探针标记重叠虚拟电极焊盘，以便评估探针标记。
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