发明申请
- 专利标题: Semiconductor memory device, method of fabricating the same, and devices employing the semiconductor memory device
- 专利标题(中): 半导体存储器件及其制造方法以及采用半导体存储器件的器件
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申请号: US11822548申请日: 2007-07-06
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公开(公告)号: US20080237685A1公开(公告)日: 2008-10-02
- 发明人: Byung-Kyu Cho , Se-Hoon Lee , Kyu-Charn Park , Choong-Ho Lee
- 申请人: Byung-Kyu Cho , Se-Hoon Lee , Kyu-Charn Park , Choong-Ho Lee
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2007-29185 20070326
- 主分类号: H01L29/788
- IPC分类号: H01L29/788 ; H01L21/336
摘要:
In one embodiment, the semiconductor memory device includes a semiconductor substrate having projecting portions, a tunnel insulation layer formed over at least one of the projecting semiconductor substrate portions, and a floating gate structure disposed over the tunnel insulation layer. An upper portion of the floating gate structure is wider than a lower portion of the floating gate structure, and the lower portion of the floating gate structure has a width less than a width of the tunnel insulating layer. First insulation layer portions are formed in the semiconductor substrate and project from the semiconductor substrate such that the floating gate structure is disposed between the projecting first insulation layer portions. A dielectric layer is formed over the first insulation layer portions and the floating gate structure, and a control gate is formed over the dielectric layer.
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