发明申请
US20080237727A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
审中-公开
半导体器件及制造半导体器件的方法
- 专利标题: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体器件及制造半导体器件的方法
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申请号: US11965563申请日: 2007-12-27
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公开(公告)号: US20080237727A1公开(公告)日: 2008-10-02
- 发明人: Reika ICHIHARA , Yoshinori Tsuchiya , Masato Koyama
- 申请人: Reika ICHIHARA , Yoshinori Tsuchiya , Masato Koyama
- 申请人地址: JP Tokyo
- 专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-85709 20070328
- 主分类号: H01L27/092
- IPC分类号: H01L27/092 ; H01L21/8238
摘要:
The present invention provides a CMIS device that achieves a low threshold voltage by use of a metal gate superior in the resistance to annealing in a reducing atmosphere. The CMIS device includes a substrate, PMISFET and NMISFET. THE PMISFET includes: an N-type semiconductor layer formed on the substrate; first source/drain regions formed in the N-type semiconductor layer; a first gate insulating film formed on the N-type semiconductor layer between the first source/drain regions; a carbon layer formed on the first gate insulating film and having a thickness of 5 nanometers or smaller; a first gate electrode formed on the carbon layer and including a metal.
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