发明申请
US20080238599A1 Chip scale power converter package having an inductor substrate
有权
具有电感器基板的芯片级功率转换器封装
- 专利标题： Chip scale power converter package having an inductor substrate
- 专利标题（中）： 具有电感器基板的芯片级功率转换器封装
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申请号： US11729311申请日： 2007-03-27
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公开(公告)号： US20080238599A1公开(公告)日： 2008-10-02
- 发明人: Francois Hebert , Ming Sun
- 申请人： Francois Hebert , Ming Sun
- 主分类号： H01F17/04
- IPC分类号： H01F17/04 ; H01F27/28
摘要：
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.
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