发明申请
- 专利标题： METHOD FOR EVALUATING SOLDER JOINT PORTION
- 专利标题（中）： 评估焊接点的方法
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申请号： US12056745申请日： 2008-03-27
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公开(公告)号： US20080240201A1公开(公告)日： 2008-10-02
- 发明人: Hirofumi KOIKE , Akikazu MATSUMOTO , Wataru YAGI , Takefumi ISOGAI , Yoshiharu HIROSE , Hiroaki KADOURA , Juntaro SEKI , Hisaaki TAKAO
- 申请人： Hirofumi KOIKE , Akikazu MATSUMOTO , Wataru YAGI , Takefumi ISOGAI , Yoshiharu HIROSE , Hiroaki KADOURA , Juntaro SEKI , Hisaaki TAKAO
- 申请人地址： JP Kariya-shi
- 专利权人： AISIN SEIKI KABUSHIKI KAISHA
- 当前专利权人： AISIN SEIKI KABUSHIKI KAISHA
- 当前专利权人地址： JP Kariya-shi
- 优先权： JP2007-093762 20070330
- 主分类号： G01N25/72
- IPC分类号： G01N25/72
摘要：
A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.
公开/授权文献
- US07658538B2 Method for evaluating solder joint portion 公开/授权日：2010-02-09
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