公开(公告)号：US20080240201A1

公开(公告)日：2008-10-02

申请号：US12056745

申请日：2008-03-27

申请人： Hirofumi KOIKE ,  Akikazu MATSUMOTO ,  Wataru YAGI ,  Takefumi ISOGAI ,  Yoshiharu HIROSE ,  Hiroaki KADOURA ,  Juntaro SEKI ,  Hisaaki TAKAO

发明人： Hirofumi KOIKE ,  Akikazu MATSUMOTO ,  Wataru YAGI ,  Takefumi ISOGAI ,  Yoshiharu HIROSE ,  Hiroaki KADOURA ,  Juntaro SEKI ,  Hisaaki TAKAO

IPC分类号： G01N25/72

CPC分类号： G01N25/72 ,  H05K3/341 ,  H05K2203/1105 ,  H05K2203/162 ,  Y02P70/613

摘要： A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.

摘要翻译： 用于评估焊接部分的方法，其中部件和基板彼此接合，包括用于制备包括焊料接合部分的基板的准备工艺，对焊接部分多次施加热冲击的热冲击工艺 以及用于获得通过施加热冲击而引起的焊料接合部分中的晶粒尺寸变化的评估过程，以便基于获得的晶粒尺寸的变化来评估焊接部分的寿命。