发明申请
- 专利标题： Method of assembling chips
- 专利标题（中）： 组装芯片的方法
-
申请号： US12109367申请日： 2008-04-25
-
公开(公告)号： US20080241992A1公开(公告)日： 2008-10-02
- 发明人: Mou-Shiung Lin , Shih-Hsiung Lin
- 申请人： Mou-Shiung Lin , Shih-Hsiung Lin
- 申请人地址： TW Hsinchu
- 专利权人： MEGICA CORPORATION
- 当前专利权人： MEGICA CORPORATION
- 当前专利权人地址： TW Hsinchu
- 优先权： TW91125126 20021025
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/44
摘要：
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
信息查询
IPC分类:
