发明申请
- 专利标题： Component-Mounting Apparatus and Component-Positioning Unit
- 专利标题（中）： 组件安装设备和组件定位单元
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申请号： US10576837申请日： 2005-05-16
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公开(公告)号： US20080244899A1公开(公告)日： 2008-10-09
- 发明人: Hiroki Endo , Teruki Nishi
- 申请人： Hiroki Endo , Teruki Nishi
- 优先权： JP2004-147043 20040517
- 国际申请： PCT/JP05/08854 WO 20050516
- 主分类号： H05K3/30
- IPC分类号： H05K3/30 ; B23P19/00
摘要：
A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion.
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