Invention Application
- Patent Title: SEMICONDUCTOR DEVICE WITH BONDING PAD
- Patent Title (中): 具有粘接垫的半导体器件
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Application No.: US11696296Application Date: 2007-04-04
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Publication No.: US20080246152A1Publication Date: 2008-10-09
- Inventor: Ming-Chyi Liu , Yuan-Hung Liu , Gwo-Yuh Shiau , Yuan-Chih Hsieh , Chi-Hsin Lo , Chia-Shiung Tsai
- Applicant: Ming-Chyi Liu , Yuan-Hung Liu , Gwo-Yuh Shiau , Yuan-Chih Hsieh , Chi-Hsin Lo , Chia-Shiung Tsai
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor device with a bonding pad is provided. The semiconductor device includes a first substrate having a device area and a bonding area, wherein the first substrate has an upper surface and a bottom surface. Semiconductor elements are disposed on the upper surface of the first substrate in the device area. A first inter-metal dielectric layer is disposed on the upper surface of the substrate in the bonding area. A lowermost metal pattern is disposed in the first inter-metal dielectric layer, wherein the lowermost metal pattern serves as the bonding pad, and the first substrate is exposed through an opening in the lowermost metal pattern.
Information query
IPC分类:
