发明申请
US20080247703A1 SUBSTRATE FOR MOUNTING IC CHIP AND DEVICE FOR OPTICAL COMMUNICATION
有权
用于安装IC芯片的基板和用于光通信的设备
- 专利标题: SUBSTRATE FOR MOUNTING IC CHIP AND DEVICE FOR OPTICAL COMMUNICATION
- 专利标题(中): 用于安装IC芯片的基板和用于光通信的设备
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申请号: US11696434申请日: 2007-04-04
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公开(公告)号: US20080247703A1公开(公告)日: 2008-10-09
- 发明人: Hiroaki KODAMA , Toyoaki Tanaka , Kazuhito Yamada
- 申请人: Hiroaki KODAMA , Toyoaki Tanaka , Kazuhito Yamada
- 申请人地址: JP Ogaki-shi
- 专利权人: IBIDEN CO., LTD
- 当前专利权人: IBIDEN CO., LTD
- 当前专利权人地址: JP Ogaki-shi
- 主分类号: G02B6/12
- IPC分类号: G02B6/12
摘要:
The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.
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