The present invention relates to an electronic device whose component body contains at least one stress relief element (4), a substrate (1) with an upper surface and side walls at least one circuit element (2) located on said substrate (1) and at least one passivation and/or isolating layer (3) placed on said substrate (1), whereby said isolating layer (3) covers said at least one circuit element (2) and/or said substrate (1) and contains a top surface, at least one outer side surface which is located towards a side wall of said substrate and at least one outer edge, which is formed by said top surface and said at least one outer side surface, characterized in that at least one stress relief element (4) is made out of a ductile material and simultaneously a) covers the top surface of said passivation and/or isolating layer (3); and b) overlaps said outer edge of said passivation and/or isolating layer (3); and c) extends along said outer surface of said passivation and/or isolating layer (3); and d1) contacts the upper surface of the substrate (1) or d2) forms a bridge with at least one circuit element (2) in that way that the stress relief element is linked with the upper surface of the substrate (1) via at least one circuit element (2).