发明申请
- 专利标题: Multi-Chip Module
- 专利标题(中): 多芯片模块
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申请号: US11733679申请日: 2007-04-10
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公开(公告)号: US20080251912A1公开(公告)日: 2008-10-16
- 发明人: Ralf Otremba , Josef Hoeglauer , Stefan Landau , Erwin Huber
- 申请人: Ralf Otremba , Josef Hoeglauer , Stefan Landau , Erwin Huber
- 主分类号: H01L23/02
- IPC分类号: H01L23/02 ; H01L21/58
摘要:
A multi-chip module includes at least one integrated circuit chip that is electrically connected to first external terminals of the multi-chip module and at least one power semiconductor chip that is electrically connected to second external terminals of the multi-chip module. All first external terminals of the multi-chip module are arranged in a contiguous region of an terminal area of the multi-chip module.
公开/授权文献
- US07872350B2 Multi-chip module 公开/授权日:2011-01-18
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