发明申请
US20080251912A1 Multi-Chip Module 有权
多芯片模块

Multi-Chip Module
摘要:
A multi-chip module includes at least one integrated circuit chip that is electrically connected to first external terminals of the multi-chip module and at least one power semiconductor chip that is electrically connected to second external terminals of the multi-chip module. All first external terminals of the multi-chip module are arranged in a contiguous region of an terminal area of the multi-chip module.
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