Invention Application
US20080257589A1 Method for the production of expandable circuit carrier and expandable circuit carrier
有权
用于生产可扩展电路载体和可扩展电路载体的方法
- Patent Title: Method for the production of expandable circuit carrier and expandable circuit carrier
- Patent Title (中): 用于生产可扩展电路载体和可扩展电路载体的方法
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Application No.: US11940640Application Date: 2007-11-15
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Publication No.: US20080257589A1Publication Date: 2008-10-23
- Inventor: Andreas Ostmann , Manuel Seckel , Thomas Loher , Dionysios Manessis , Rainer Patzelt
- Applicant: Andreas Ostmann , Manuel Seckel , Thomas Loher , Dionysios Manessis , Rainer Patzelt
- Priority: DE102006055576.7 20061121
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K3/02
Abstract:
The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.
Public/Granted literature
- US08654536B2 Expandable circuit carrier Public/Granted day:2014-02-18
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