发明申请
US20080257715A1 Method of Deposition with Reduction of Contaminants in An Ion Assist Beam and Associated Apparatus
审中-公开
在离子辅助束和相关装置中减少污染物的沉积方法
- 专利标题: Method of Deposition with Reduction of Contaminants in An Ion Assist Beam and Associated Apparatus
- 专利标题(中): 在离子辅助束和相关装置中减少污染物的沉积方法
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申请号: US11664343申请日: 2004-10-13
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公开(公告)号: US20080257715A1公开(公告)日: 2008-10-23
- 发明人: Peter Hoghoj , Paraskevi Ntova , Claude Montcalm , Sergio Rodrigues
- 申请人: Peter Hoghoj , Paraskevi Ntova , Claude Montcalm , Sergio Rodrigues
- 国际申请: PCT/IB2004/003574 WO 20041013
- 主分类号: C23C14/34
- IPC分类号: C23C14/34
摘要:
The invention relates to a dual Ion Beam Sputtering method for depositing onto a substrate (S) material generated by the sputtering of a target (121-123) by a sputtering ion beam (110), said method comprising the operation of an assistance ion beam (130) directed onto said substrate in order to assist the deposition of material, said method being characterized in that during the operation of said assistance beam said sputtering beam is also operated in association with said assistance beam, and during said operation of the sputtering beam in association with the assistance beam the sputtering beam crosses a desired part of the assistance beam in order to transport contaminants associated to said desired part of the assistance beam away from said substrate.
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