Light emitting device 1 includes an LED chip 10, a mounting substrate 20 carrying the LED chip, a dome-shaped color conversion member 70, and encapsulation member 50. Color conversion member 70 is molded from a transparent resin material and a fluorescent material which is excited by a light emitted from the LED chip to emit a light of a color different from a luminescent color of the LED chip, and is bonded to the mounting substrate to surround LED chip 10. Encapsulation member 50 is made of an encapsulation resin material to encapsulate LED chip 10 and bonding wires 14 within a space confined between mounting board 20 and color conversion member 70. Encapsulation member 50 is of a convex-shape to have its light output surface 50b kept in an intimate contact with an internal surface of color conversion member 70. Since the intimate contact between the convex-lens shaped encapsulation member 50 and the color conversion member is made without the use of a conventional frame, the light emitting device can restrain the generation of voids in the encapsulation member, and therefore give improved reliability. Moreover, the light output efficiency is also improved.