发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING
- 专利标题（中）： 用于封装堆栈的集成电路封装系统
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申请号： US12057360申请日： 2008-03-27
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公开(公告)号： US20080258289A1公开(公告)日： 2008-10-23
- 发明人: Rajendra D. Pendse , Flynn Carson , Il Kwon Shim , Seng Guan Chow
- 申请人： Rajendra D. Pendse , Flynn Carson , Il Kwon Shim , Seng Guan Chow
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/52
摘要：
An integrated circuit package system comprising: forming an area array substrate; mounting surface conductors on the area array substrate; forming a molded package body on the area array substrate and the surface conductors; providing a step in the molded package body; and exposing a surface conductor by the step.
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