发明申请
US20080265383A1 Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
有权
具有半导体芯片的工件，半导体器件和用半导体芯片生产工件的方法
- 专利标题： Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
- 专利标题（中）： 具有半导体芯片的工件，半导体器件和用半导体芯片生产工件的方法
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申请号： US11939938申请日： 2007-11-14
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公开(公告)号： US20080265383A1公开(公告)日： 2008-10-30
- 发明人: Markus Brunnbauer , Jens Pohl , Klaus Pressel , Thorsten Meyer , Recai Sezi , Stephan Bradl , Ralf Plieninger
- 申请人： Markus Brunnbauer , Jens Pohl , Klaus Pressel , Thorsten Meyer , Recai Sezi , Stephan Bradl , Ralf Plieninger
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102007020656.0 20070430
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/56
摘要：
A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.
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