发明申请
- 专利标题: Electromagnetic bandgap structure and printed circuit board
- 专利标题(中): 电磁带隙结构和印刷电路板
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申请号: US12007122申请日: 2008-01-07
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公开(公告)号: US20080266018A1公开(公告)日: 2008-10-30
- 发明人: Mi-Ja Han , Han Kim , Dae-Hyun Park , Hyo-Jic Jung
- 申请人: Mi-Ja Han , Han Kim , Dae-Hyun Park , Hyo-Jic Jung
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0041991 20070430
- 主分类号: H01P1/20
- IPC分类号: H01P1/20
摘要:
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.
公开/授权文献
- US07764149B2 Electromagnetic bandgap structure and printed circuit board 公开/授权日:2010-07-27
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