公开(公告)号：US08699234B2

公开(公告)日：2014-04-15

申请号：US12984935

申请日：2011-01-05

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K1/18

CPC分类号： H05K1/0236 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H05K3/4694

摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.

摘要翻译： 其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。 第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。 第二板部分位于第一板部分的下表面上。 电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

公开(公告)号：US20110067914A1

公开(公告)日：2011-03-24

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US08212150B2

公开(公告)日：2012-07-03

申请号：US12654368

申请日：2009-12-17

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.

摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括：具有接地层和功率层的第一区域; 放置在其中具有电磁带隙结构的第一区域的侧部的第二区域。 电磁带隙结构包括：多个第一导电板和沿着第一区域的侧面部分放置在同一平面上的多个第二导电板; 以及缝合通孔，其被构造成通过不同于所述第一导电板和所述第二导电板的平坦表面将所述第一导电板电连接到所述第二导电板。

公开(公告)号：US07764149B2

公开(公告)日：2010-07-27

申请号：US12007122

申请日：2008-01-07

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

IPC分类号： H01P1/203 ,  H01P5/08

CPC分类号： H01Q15/008 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括金属层; 以及包括金属板和通孔的多个蘑菇型结构。 这里，多个蘑菇型结构体可以以叠层结构形成在金属层上。 通过本发明，小型电磁带隙结构可以具有较低的带隙频率。

公开(公告)号：US20080266018A1

公开(公告)日：2008-10-30

申请号：US12007122

申请日：2008-01-07

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

IPC分类号： H01P1/20

CPC分类号： H01Q15/008 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括金属层; 以及包括金属板和通孔的多个蘑菇型结构。 这里，多个蘑菇型结构体可以以叠层结构形成在金属层上。 通过本发明，小型电磁带隙结构可以具有较低的带隙频率。

公开(公告)号：US08258408B2

公开(公告)日：2012-09-04

申请号：US12654545

申请日：2009-12-22

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

摘要翻译： 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿着板的边缘放置的多个第一导电板，设置在不同于第一导电板的平面上的多个第二导电板，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。

公开(公告)号：US08242377B2

公开(公告)日：2012-08-14

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。

公开(公告)号：US20110299264A1

公开(公告)日：2011-12-08

申请号：US12984935

申请日：2011-01-05

申请人： Han KIM ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han KIM ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H05K3/4694

摘要： The present invention provides an EMI noise shield board in which an EBG structure is inserted. The EMI noise shield board in accordance with an embodiment of the present invention can include: a first board portion, an electronic part being mounted on an upper surface of the first board portion, a circuit for transferring a signal and power to the electronic part being in the first board portion; and a second board portion located on a lower surface of the first board portion, an electromagnetic bandgap structure being inserted into the second board portion, the electromagnetic bandgap structure having a band stop frequency property in such a way that an EMI noise transferred from the first board portion can be shielded from being radiated to the outside of a board.

摘要翻译： 本发明提供一种其中插入有EBG结构的EMI噪声屏蔽板。 根据本发明的实施例的EMI噪声屏蔽板可以包括：第一板部分，安装在第一板部分的上表面上的电子部件，用于将信号和电力传送到电子部件的电路， 在第一板部分; 以及第二板部分，位于第一板部分的下表面上，电磁带隙结构插入到第二板部分中，电磁带隙结构具有带阻频率特性，使得从第一板部分转移的EMI噪声 板部分可以被屏蔽以免被辐射到板的外部。

公开(公告)号：US20110067915A1

公开(公告)日：2011-03-24

申请号：US12654368

申请日：2009-12-17

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.

摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括：具有接地层和功率层的第一区域; 放置在其中具有电磁带隙结构的第一区域的侧部的第二区域。 电磁带隙结构包括：多个第一导电板和沿着第一区域的侧面部分放置在同一平面上的多个第二导电板; 以及缝合通孔，其被构造成通过不同于所述第一导电板和所述第二导电板的平坦表面将所述第一导电板电连接到所述第二导电板。

公开(公告)号：US20110031007A1

公开(公告)日：2011-02-10

申请号：US12654545

申请日：2009-12-22

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

摘要翻译： 作为多层板，具有插入板的内部的具有带阻频率特性的电磁带隙结构的EMI降噪板包括形成有接地层和功率层的第一区域，以及 第二区域，放置在第一区域的侧表面上，其中形成有电磁带隙结构，以便屏蔽通过第一区域的侧表面辐射到外部的EMI噪声。 电磁带隙结构包括沿着板的边缘放置的多个第一导电板，设置在不同于第一导电板的平面上的多个第二导电板，使得第二导电板交替地布置有 第一导电板和将第一导电板连接到第二导电板的通孔。