In an electrostatic chuck for chucking a glass substrate, the electrostatic chuck includes a pair of electrodes embedded in a ceramic material and interlaced with each other, where a volume resistivity of the ceramic material is 1×108 Ωcm to 1×1014 Ωcm, a thickness of the ceramic material on a chucking surface side to cover the pair of electrodes is 100 μm to 200 μm, a pattern width of the pair of electrodes is 0.5 mm to 1 mm, and a minimum distance between the pair of electrodes is 0.5 mm to 1 mm.