发明申请
- 专利标题: Layer forming method using plasma discharge
- 专利标题(中): 使用等离子体放电的层形成方法
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申请号: US12156337申请日: 2008-05-30
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公开(公告)号: US20080268172A1公开(公告)日: 2008-10-30
- 发明人: Kazuhiro Fukuda , Yoshikazu Kondo , Takashi Murakami , Shunichi Iwamaru , Yumi Muramatsu , Toshio Tsuji
- 申请人: Kazuhiro Fukuda , Yoshikazu Kondo , Takashi Murakami , Shunichi Iwamaru , Yumi Muramatsu , Toshio Tsuji
- 申请人地址: JP Tokyo
- 专利权人: KONICA CORPORATION
- 当前专利权人: KONICA CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2000-377044 20001212; JP2001-175475 20010611
- 主分类号: H05H1/24
- IPC分类号: H05H1/24
摘要:
A layer forming method is disclosed which relies on reactive gas in a plasma state. The method includes steps of supplying power of not less than 1 W/cm2 at a high frequency voltage exceeding 100 kHz across a gap between a first electrode and a second electrode opposed to each other at atmospheric pressure or at approximately atmospheric pressure to induce a discharge, generating a reactive gas in a plasma state by the charge, and exposing a substrate to the reactive gas in a plasma state to form a layer on the substrate.
公开/授权文献
- US2166142A Sulphocarboxylic acid esters 公开/授权日:1939-07-18
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