发明申请
- 专利标题： Modification of polymeric materials for increased adhesion
- 专利标题（中）： 聚合物材料的改性增加附着力
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申请号： US11712180申请日： 2007-02-28
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公开(公告)号： US20080276497A1公开(公告)日： 2008-11-13
- 发明人: Richard T. Chou , Kye Hyun Kim
- 申请人： Richard T. Chou , Kye Hyun Kim
- 主分类号： A43B13/42
- IPC分类号： A43B13/42 ; C08J9/32 ; A43B23/08
摘要：
A method of improving the adhesion of primers and adhesives to the surface of a polymeric material is provided. In this method, the adhesion is improved by modifying the polymeric material with a filler. Preferably, the filler comprises hollow microspheres or nanoparticles. Silica is a preferred filler.
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