发明申请
- 专利标题: FIN FILLED EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- 专利标题(中): FIN填充效应晶体管及其形成方法
-
申请号: US11744896申请日: 2007-05-07
-
公开(公告)号: US20080277745A1公开(公告)日: 2008-11-13
- 发明人: Ju-Wang Hsu , Chih-Yuan Ting , Tang-Xuan Zhong , Yi-Nien Su , Jang-Shiang Tsai
- 申请人: Ju-Wang Hsu , Chih-Yuan Ting , Tang-Xuan Zhong , Yi-Nien Su , Jang-Shiang Tsai
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/76
摘要:
A fin field effect transistor and method of forming the same. The fin field effect transistor comprises a semiconductor substrate having a fin structure and between two trenches with top portions and bottom portions. The fin field effect transistor further comprises shallow trench isolations formed in the bottom portions of the trenches and a gate electrode over the fin structure and the shallow trench isolation, wherein the gate electrode is substantially perpendicular to the fin structure. The fin field effect transistor further comprises a gate dielectric layer along sidewalls of the fin structure and source/drain electrode formed in the fin structure.
公开/授权文献
- US08927353B2 Fin field effect transistor and method of forming the same 公开/授权日:2015-01-06
信息查询
IPC分类: