发明申请
- 专利标题： Multilayer ceramic substrate
- 专利标题（中）： 多层陶瓷基板
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申请号： US12149193申请日： 2008-04-29
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公开(公告)号： US20080283281A1公开(公告)日： 2008-11-20
- 发明人: Kenji Endou , Kiyoshi Hatanaka , Masaharu Hirakawa , Haruo Nishino , Hideaki Fujioka
- 申请人： Kenji Endou , Kiyoshi Hatanaka , Masaharu Hirakawa , Haruo Nishino , Hideaki Fujioka
- 申请人地址： JP Tokyo
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2005-121666 20050419; JP2005-192496 20050630; JP2005-216570 20050726; JP2005-216572 20050726; JP2005-359591 20051213; JP2005-362116 20051215; JP2005-369472 20051222
- 主分类号： H05K1/18
- IPC分类号： H05K1/18
摘要：
A multilayer ceramic substrate includes a plurality of ceramic layers laminated each other. The plurality of ceramic layers form a bulge and a cavity having such a shape that an opening area of the cavity gradually becomes smaller toward a bottom of the cavity.
公开/授权文献
- US07733663B2 Multilayer ceramic substrate 公开/授权日：2010-06-08
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