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公开(公告)号：US07733663B2
公开(公告)日：2010-06-08
申请号：US12149193
申请日：2008-04-29
IPC分类号： H05K1/18
CPC分类号： H01L23/15 , H01L21/4807 , H01L21/4857 , H01L23/13 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15156 , H01L2924/15157 , H01L2924/1517 , H01L2924/15787 , H05K1/0306 , H05K1/183 , H05K3/4629 , H05K3/4697 , H05K2203/063 , H05K2203/308 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T156/1056 , Y10T428/24926 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayer ceramic substrate includes a plurality of ceramic layers laminated each other. The plurality of ceramic layers form a bulge and a cavity having such a shape that an opening area of the cavity gradually becomes smaller toward a bottom of the cavity.
摘要翻译： 多层陶瓷基板包括彼此层叠的多个陶瓷层。 多个陶瓷层形成凸起，并且具有使空腔的开口面朝着空腔的底部逐渐变小的形状的空腔。
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公开(公告)号：US20080283281A1
公开(公告)日：2008-11-20
申请号：US12149193
申请日：2008-04-29
IPC分类号： H05K1/18
CPC分类号： H01L23/15 , H01L21/4807 , H01L21/4857 , H01L23/13 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15156 , H01L2924/15157 , H01L2924/1517 , H01L2924/15787 , H05K1/0306 , H05K1/183 , H05K3/4629 , H05K3/4697 , H05K2203/063 , H05K2203/308 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T156/1056 , Y10T428/24926 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayer ceramic substrate includes a plurality of ceramic layers laminated each other. The plurality of ceramic layers form a bulge and a cavity having such a shape that an opening area of the cavity gradually becomes smaller toward a bottom of the cavity.
摘要翻译： 多层陶瓷基板包括彼此层叠的多个陶瓷层。 多个陶瓷层形成凸起，并且具有使空腔的开口面朝着空腔的底部逐渐变小的形状的空腔。
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公开(公告)号：US07578058B2
公开(公告)日：2009-08-25
申请号：US11405462
申请日：2006-04-18
IPC分类号： H01K3/22
CPC分类号： H01L23/15 , H01L21/4807 , H01L21/4857 , H01L23/13 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15156 , H01L2924/15157 , H01L2924/1517 , H01L2924/15787 , H05K1/0306 , H05K1/183 , H05K3/4629 , H05K3/4697 , H05K2203/063 , H05K2203/308 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T156/1056 , Y10T428/24926 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the cavity to form a multilayer body, pressing the multilayer body and firing the pressed body. At this time, a shrinkage suppression green sheet is laminated on the surface of the a ceramic green sheet constituting the outermost layer of the multilayer body, and a shrinkage suppression green sheet piece is disposed on the ceramic green sheet exposed to the bottom of the cavity in accordance with the shape of the cavity. A burnable sheet is further disposed on the shrinkage suppression green sheet piece. Before the pressing step, an embedded green sheet separate from the ceramic green sheets (portion separated by inserting a cut) is disposed on the shrinkage suppression green sheet piece or the burnable sheet so that it is filled in the cavity. After the firing step, the embedded green sheet fired is removed.
摘要翻译： 具有空腔的多层陶瓷基板通过层叠多个陶瓷生片的步骤而形成，所述多个陶瓷生片包括具有与所述腔相对应的通孔的陶瓷生片，以形成多层体，压制所述多层体并烧制所述压制体。 此时，在构成多层体的最外层的陶瓷生片的表面上层叠收缩抑制生片，在暴露于空腔的底部的陶瓷生片上设置收缩抑制生片 按照腔体的形状。 另外在收缩抑制生片上设置可燃片材。 在压制步骤之前，将收缩抑制生片或可燃片材与陶瓷生片（通过插入切口分开的部分）分开的嵌入的生片放置在空腔中。 在烧制步骤之后，除去烧成的嵌入的生片。
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公开(公告)号：US20060234023A1
公开(公告)日：2006-10-19
申请号：US11405462
申请日：2006-04-18
CPC分类号： H01L23/15 , H01L21/4807 , H01L21/4857 , H01L23/13 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15156 , H01L2924/15157 , H01L2924/1517 , H01L2924/15787 , H05K1/0306 , H05K1/183 , H05K3/4629 , H05K3/4697 , H05K2203/063 , H05K2203/308 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T156/1056 , Y10T428/24926 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the cavity to form a multilayer body, pressing the multilayer body and firing the pressed body. At this time, a shrinkage suppression green sheet is laminated on the surface of the a ceramic green sheet constituting the outermost layer of the multilayer body, and a shrinkage suppression green sheet piece is disposed on the ceramic green sheet exposed to the bottom of the cavity in accordance with the shape of the cavity. A burnable sheet is further disposed on the shrinkage suppression green sheet piece. Before the pressing step, an embedded green sheet separate from the ceramic green sheets (portion separated by inserting a cut) is disposed on the shrinkage suppression green sheet piece or the burnable sheet so that it is filled in the cavity. After the firing step, the embedded green sheet fired is removed.
摘要翻译： 具有空腔的多层陶瓷基板通过层叠多个陶瓷生片的步骤而形成，所述多个陶瓷生片包括具有与所述腔相对应的通孔的陶瓷生片，以形成多层体，压制所述多层体并烧制所述压制体。 此时，在构成多层体的最外层的陶瓷生片的表面上层叠收缩抑制生片，在暴露于空腔的底部的陶瓷生片上设置收缩抑制生片 按照腔体的形状。 另外在收缩抑制生片上设置可燃片材。 在压制步骤之前，将收缩抑制生片或可燃片材与陶瓷生片（通过插入切口分开的部分）分开的嵌入的生片放置在空腔中。 在烧制步骤之后，除去烧成的嵌入的生片。
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公开(公告)号：US07155816B2
公开(公告)日：2007-01-02
申请号：US10354972
申请日：2003-01-31
IPC分类号： H05K3/36
CPC分类号： H01L23/15 , H01L23/13 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L2924/0002 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/3011 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K1/183 , H05K3/4611 , H05K3/4629 , H05K3/4697 , H05K2203/063 , Y10T29/43 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49833 , Y10T428/252 , H01L2924/00
摘要： A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and printing a conductor at a predetermined position of the green sheets, laminating the green sheets to constitute a green sheet laminate, and applying a pressure to the green sheet laminate by using a compression member having a projection at a position corresponding to the cavity to thereby compress the green sheet laminate. The projection has a height which is equal to the depth of the cavity multiplied by compression ratio of the green sheet laminate, and the green sheet laminate is compressed by applying the pressure such that compression ratio of the bottom of the cavity is identical with the compression ratio of other parts of the green sheet laminate.
摘要翻译： 一种具有形成有空腔的多层陶瓷基板的制造方法，其特征在于，在构成层叠体的生片中冲压与所述空腔对应的通孔，在所述生片的规定位置印刷导体，层叠所述生片以构成绿色 并且通过使用在与空腔相对应的位置处具有突起的压缩构件对生片层压体施加压力，从而压缩生片层压体。 突起的高度等于生坯片层压体的压缩比与腔的深度相乘，并且通过施加压力使生坯片层压体压缩，使得腔的底部的压缩比与压缩相同 生片层压板的其他部分的比例。
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公开(公告)号：US20080152928A1
公开(公告)日：2008-06-26
申请号：US12000177
申请日：2007-12-10
申请人： Yasuharu Miyauchi , Toshiyuki Suzuki , Masaharu Hirakawa , Tomoko Nakamura , Toshinobu Miyakoshi , Kiyoshi Hatanaka
发明人： Yasuharu Miyauchi , Toshiyuki Suzuki , Masaharu Hirakawa , Tomoko Nakamura , Toshinobu Miyakoshi , Kiyoshi Hatanaka
IPC分类号： B32B17/06
CPC分类号： H05K3/38 , H01L21/4807 , H01L23/15 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/4611 , H05K3/4629 , H05K2201/017 , H05K2203/1163 , H05K2203/308 , Y10T428/31678 , H01L2924/00
摘要： A highly reliable ceramics substrate which can sufficiently secure a bonding strength of a surface conductor in an initial state and after a lapse of time (e.g., after a PCT) is provided. The multilayer ceramics substrate has a surface conductor on at least one surface of a multilayer body constituted by a plurality of laminated ceramics substrate layers. A reaction phase formed by a reaction between a ceramics component in the ceramics substrate layers and a glass component in the surface conductor is deposited at an interface between the surface conductor and ceramics substrate layers. For example, an alumina filler in the ceramics substrate layers and Zn in the surface conductor react with each other, thereby forming ZnAl2O4 as the reaction phase.
摘要翻译： 提供了一种高度可靠的陶瓷基板，其能够充分确保初始状态下和经过时间（例如，PCT之后）的表面导体的结合强度。 多层陶瓷基板在由多层叠陶瓷基板层构成的多层体的至少一个面上具有表面导体。 通过陶瓷基板层中的陶瓷部件与表面导体中的玻璃成分之间的反应形成的反应相沉积在表面导体与陶瓷基板层之间的界面处。 例如，陶瓷基体层中的氧化铝填料和表面导体中的Zn彼此反应，从而形成作为反应相的ZnAl 2 O 4 O 4。
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公开(公告)号：US07662477B2
公开(公告)日：2010-02-16
申请号：US12000177
申请日：2007-12-10
申请人： Yasuharu Miyauchi , Toshiyuki Suzuki , Masaharu Hirakawa , Tomoko Nakamura , Toshinobu Miyakoshi , Kiyoshi Hatanaka
发明人： Yasuharu Miyauchi , Toshiyuki Suzuki , Masaharu Hirakawa , Tomoko Nakamura , Toshinobu Miyakoshi , Kiyoshi Hatanaka
IPC分类号： B32B15/00
CPC分类号： H05K3/38 , H01L21/4807 , H01L23/15 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/4611 , H05K3/4629 , H05K2201/017 , H05K2203/1163 , H05K2203/308 , Y10T428/31678 , H01L2924/00
摘要： A highly reliable ceramics substrate which can sufficiently secure a bonding strength of a surface conductor in an initial state and after a lapse of time (e.g., after a PCT) is provided. The multilayer ceramics substrate has a surface conductor on at least one surface of a multilayer body constituted by a plurality of laminated ceramics substrate layers. A reaction phase formed by a reaction between a ceramics component in the ceramics substrate layers and a glass component in the surface conductor is deposited at an interface between the surface conductor and ceramics substrate layers. For example, an alumina filler in the ceramics substrate layers and Zn in the surface conductor react with each other, thereby forming ZnAl2O4 as the reaction phase.
摘要翻译： 提供了一种高度可靠的陶瓷基板，其能够充分确保初始状态下和经过时间（例如，PCT之后）的表面导体的结合强度。 多层陶瓷基板在由多层叠陶瓷基板层构成的多层体的至少一个面上具有表面导体。 通过陶瓷基板层中的陶瓷部件与表面导体中的玻璃成分之间的反应形成的反应相沉积在表面导体与陶瓷基板层之间的界面处。 例如，陶瓷基体层中的氧化铝填料和表面导体中的Zn彼此反应，从而形成作为反应相的ZnAl 2 O 4。
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公开(公告)号：US20050189137A1
公开(公告)日：2005-09-01
申请号：US11059585
申请日：2005-02-17
IPC分类号： C04B35/622 , C04B35/00 , C04B35/495 , H01G4/06 , H01G4/20 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/00 , H05K3/46
CPC分类号： H05K1/162 , H05K1/0306 , H05K3/005 , H05K3/4611 , H05K3/4629 , H05K2201/0187 , Y10T29/49155 , Y10T29/49162 , Y10T29/49163 , Y10T29/49165 , Y10T156/1056 , Y10T156/1057 , Y10T428/24322
摘要： An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.
摘要翻译： 本发明的目的是在多层陶瓷基板中的片材的主表面的方向上彼此电连接不同的电介质，并且增加设计的柔性程度，并使多层陶瓷基板的尺寸更小。 根据本发明的多层陶瓷基板由多个层叠陶瓷基板形成，该多个层叠陶瓷基板包括这样的不同材料的复合陶瓷基板，该复合陶瓷基板是通过将第二陶瓷基板插入在第一陶瓷基板中形成的突出部分而形成的， 平面化其顶表面和底表面，其中导电层形成在穿过不同材料的复合陶瓷衬底的界面的第一陶瓷衬底和第二陶瓷衬底之间的边界的部分中。
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公开(公告)号：US20060127568A1
公开(公告)日：2006-06-15
申请号：US10542846
申请日：2004-01-20
IPC分类号： B05D5/12
CPC分类号： H05K1/0306 , H01L23/15 , H01L23/49822 , H01L2924/0002 , H05K3/4611 , H05K3/4629 , H05K2201/0187 , H01L2924/00
摘要： A plurality of first green sheets forming first ceramic layers after firing are stacked to form a first pre-fired substrate 4. Next, a plurality of second green sheets forming second ceramic layers after firing are stacked to form a second pre-fired substrate. Next, the first pre-fired substrate 4 is formed with recesses 10. Next, first pre-fired blocks 6 of sizes fitting into the recesses are formed from the second pre-fired substrate. The first pre-fired blocks 6 are fit into the recesses 10 so that the stacking direction A of the first green sheets and the stacking direction A′ of the second green sheets become the same. The first pre-fired substrate 4 in which the first pre-fired blocks 6 are fit is fired.
摘要翻译： 在烧成后形成第一陶瓷层的多个第一生片层叠，形成第一预烧基板4。 接下来，堆叠在焙烧后形成第二陶瓷层的多个第二生片，以形成第二预烧基板。 接下来，第一预烧基板4形成有凹部10。 接下来，由第二预烧基板形成装配到凹部中的尺寸的第一预烧块6。 第一预烧块6装配到凹部10中，使得第一生坯的堆叠方向A和第二生坯的层叠方向A'变得相同。 烧制第一预烧块6的第一预烧基板4。
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公开(公告)号：US07243424B2
公开(公告)日：2007-07-17
申请号：US11059585
申请日：2005-02-17
IPC分类号： H01K3/10
CPC分类号： H05K1/162 , H05K1/0306 , H05K3/005 , H05K3/4611 , H05K3/4629 , H05K2201/0187 , Y10T29/49155 , Y10T29/49162 , Y10T29/49163 , Y10T29/49165 , Y10T156/1056 , Y10T156/1057 , Y10T428/24322
摘要： An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.
摘要翻译： 本发明的目的是在多层陶瓷基板中的片材的主表面的方向上彼此电连接不同的电介质，并且增加设计的柔性程度，并使多层陶瓷基板的尺寸更小。 根据本发明的多层陶瓷基板由多个层叠陶瓷基板形成，该多个层叠陶瓷基板包括这样的不同材料的复合陶瓷基板，该复合陶瓷基板是通过将第二陶瓷基板插入在第一陶瓷基板中形成的突出部分而形成的， 平面化其顶表面和底表面，其中导电层形成在穿过不同材料的复合陶瓷衬底的界面的第一陶瓷衬底和第二陶瓷衬底之间的边界的部分中。
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