发明申请
- 专利标题: Photosensitive Resin Composition and Cured Product Thereof
- 专利标题(中): 光敏树脂组合物及其固化产品
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申请号: US10585699申请日: 2005-01-21
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公开(公告)号: US20080286688A1公开(公告)日: 2008-11-20
- 发明人: Hiroo Koyanagi , Ryutaro Tanaka , Hideaki Kametani
- 申请人: Hiroo Koyanagi , Ryutaro Tanaka , Hideaki Kametani
- 优先权: JP2004-016751 20040126
- 国际申请: PCT/JP2005/000761 WO 20050121
- 主分类号: G03F7/004
- IPC分类号: G03F7/004
摘要:
[PROBLEMS] To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof. [MEANS FOR SOLVING PROBLEMS] A photosensitive resin composition comprising a carboxyl group-containing resin (A) which is a reaction product of a compound (a) represented by the following formula (1): wherein n is an average value of 1 to 20; R1 and R2 may be the same or different, and are each a hydrogen atom, a halogen atom or a C1 to C4 lower alkyl group; R3, R5, R8 and R10 may be the same or different, and are each a hydrogen atom, a halogen atom or a methyl group; and R4, R6, R7 and R9 may be the same or different, and are each a hydrogen atom or a methyl group, a compound (b) having an ethylenically unsaturated group and a glycidyl group in the molecule and a polybasic acid anhydride (c), a crosslinking agent (B) and a photopolymerization initiator (C), and a cured product thereof.