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    Photosensitive resin composition and cured article thereof
    6.
    发明申请
    Photosensitive resin composition and cured article thereof 审中-公开
    光敏树脂组合物及其固化制品

    公开(公告)号：US20090042126A1

    公开(公告)日：2009-02-12

    申请号：US11988903

    申请日：2006-07-20

    申请人： Ryutaro Tanaka ,  Toru Kurihashi ,  Hiroo Koyanagi

    发明人： Ryutaro Tanaka ,  Toru Kurihashi ,  Hiroo Koyanagi

    IPC分类号： G03F7/004

    CPC分类号： C08F283/10 ,  C08F290/00 ,  C08F290/02 ,  C08F299/00 ,  C08F299/02 ,  C08G59/1466 ,  C08G59/42 ,  C08L63/00 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0388 ,  H05K3/287

    摘要： A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided.An alkaline aqueous solution-soluble photosensitive resin composition containing an alkaline aqueous solution-soluble resin (A) obtained by adding a polybasic acid anhydride (c) to a resin (C) which is a reaction product of an epoxy resin (a) represented by the formula (1) with an unsaturated monocarboxylic acid (b), an epoxy resin (a′) represented by the formula (1) as a curing agent (B) and a photopolymerization initiator. [In the formula, n represents a positive number of 1 to 10 as an average value.]

    摘要翻译： 提供了光敏性优异，耐火性，柔韧性，粘合性，铅笔硬度，耐溶剂性，耐酸性，耐热性，耐镀金性等优异的感光性树脂组合物及其固化物。 一种碱性水溶性可溶性感光性树脂组合物，其含有通过将多元酸酐（c）添加到由（C）表示的环氧树脂（a）的反应产物的树脂（C）中而获得的碱性水溶性溶液性树脂（A） 具有不饱和一元羧酸（b）的式（1），作为固化剂（B）的式（1）表示的环氧树脂（a'）和光聚合引发剂。 [式中，n表示作为平均值的1〜10的正数]

    Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof
    7.
    发明申请
    Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof 审中-公开
    含有不饱和基团的聚酰胺酸树脂，使用其的感光性树脂组合物及其固化物

    公开(公告)号：US20080306180A1

    公开(公告)日：2008-12-11

    申请号：US10583644

    申请日：2004-12-20

    申请人： Chika Amishima ,  Ryutaro Tanaka ,  Hideaki Kametani ,  Hiroo Koyanagi

    发明人： Chika Amishima ,  Ryutaro Tanaka ,  Hideaki Kametani ,  Hiroo Koyanagi

    IPC分类号： C08L77/06 ,  C08F2/46

    CPC分类号： C08L79/08 ,  C08G73/16 ,  G03F7/037 ,  H05K1/0346 ,  H05K3/3452

    摘要： The present invention provides a novel polyamide acid resin (A) containing an unsaturated group, suitable to a photosensitive resin composition, and a photosensitive resin composition using the same, which is excellent in photosensitivity, and the resultant cured product is excellent in flexibility as well as adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, and the like. Said polyamide acid resin (A) containing an unsaturated group is obtained by reacting an unsaturated group-containing polyester resin (a) having a terminal anhydride group, and a compound (b) having two amino groups in a molecule, and said photosensitive resin composition is obtained by reacting a resin composition containing said polyamide acid resin (A) containing an unsaturated group, a crosslinker (B) and a photopolymerization initiator (C).

    摘要翻译： 本发明提供一种适用于感光性树脂组合物的含有不饱和基团的新型聚酰胺酸树脂（A）和使用该聚酰胺树脂组合物的感光性树脂组合物，其光敏性优异，得到的固化物的柔软性优异 作为粘合性，铅笔硬度，耐溶剂性，耐酸性，耐热性，耐镀金性等。 所述含有不饱和基团的聚酰胺酸树脂（A）通过使具有末端酸酐基的不饱和基团的聚酯树脂（a）和分子中具有两个氨基的化合物（b）反应而获得，并且所述感光性树脂组合物 通过使含有不饱和基团的聚酰胺酸树脂（A），交联剂（B）和光聚合引发剂（C）的树脂组合物反应而得到。

    Photosensitive Resin Composition and Cured Product Thereof
    8.
    发明申请
    Photosensitive Resin Composition and Cured Product Thereof 审中-公开
    光敏树脂组合物及其固化产品

    公开(公告)号：US20080286688A1

    公开(公告)日：2008-11-20

    申请号：US10585699

    申请日：2005-01-21

    申请人： Hiroo Koyanagi ,  Ryutaro Tanaka ,  Hideaki Kametani

    发明人： Hiroo Koyanagi ,  Ryutaro Tanaka ,  Hideaki Kametani

    IPC分类号： G03F7/004

    CPC分类号： G03F7/027 ,  G03F7/038

    摘要： [PROBLEMS] To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof. [MEANS FOR SOLVING PROBLEMS] A photosensitive resin composition comprising a carboxyl group-containing resin (A) which is a reaction product of a compound (a) represented by the following formula (1): wherein n is an average value of 1 to 20; R1 and R2 may be the same or different, and are each a hydrogen atom, a halogen atom or a C1 to C4 lower alkyl group; R3, R5, R8 and R10 may be the same or different, and are each a hydrogen atom, a halogen atom or a methyl group; and R4, R6, R7 and R9 may be the same or different, and are each a hydrogen atom or a methyl group, a compound (b) having an ethylenically unsaturated group and a glycidyl group in the molecule and a polybasic acid anhydride (c), a crosslinking agent (B) and a photopolymerization initiator (C), and a cured product thereof.

    摘要翻译： [问题]为了提供具有优异的光敏性的感光性树脂组合物，其固化产物的粘合性，铅笔硬度，耐溶剂性，耐酸性，耐热性，耐镀金性，HAST性，阻燃性，柔软性等优异的固化产物 。 解决问题的手段一种含有含羧基的树脂（A）的感光性树脂组合物，其是由下式（1）表示的化合物（a）的反应产物：其中n为1〜20的平均值 ; R 1和R 2可以相同或不同，并且各自为氢原子，卤素原子或C 1 -C 6烷基， 低级烷基;低级烷基;低级烷基; R 3，R 5，R 8和R 10可以相同或不同，并且各自为 氢原子，卤素原子或甲基; 和R 4，R 6，R 7和R 9可以相同或不同，并且各自为 氢原子或甲基，分子中具有烯键式不饱和基团和缩水甘油基的化合物（b）和多元酸酐（c），交联剂（B）和光聚合引发剂（C），以及 其固化产物。

    Photosensitive resin composition and curing product thereof
    9.
    发明授权
    Photosensitive resin composition and curing product thereof 有权
    感光树脂组合物及其固化产物

    公开(公告)号：US07374862B2

    公开(公告)日：2008-05-20

    申请号：US10547907

    申请日：2004-03-04

    申请人： Ryutaro Tanaka ,  Hiroo Koyanagi

    发明人： Ryutaro Tanaka ,  Hiroo Koyanagi

    IPC分类号： G03F7/027

    CPC分类号： C08G18/773 ,  C08F290/067 ,  C08G18/4837 ,  C08G18/5015 ,  C08G18/5021 ,  C08G18/5072 ,  C09J175/04 ,  G03F7/027 ,  G03F7/038

    摘要： A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin (A) soluble in aqueous alkali solutions, the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).

    摘要翻译： 对光化学能量射线（感光度）的敏感性优异的感光性树脂组合物在短时间内是可硬化的，并且可以通过用稀释的碱水溶液显影形成图案，并且通过后固化步骤中的热固化得到固化膜， 该固化膜具有令人满意的柔性并适用于绝缘性优异的镀金，无电镀金和镀锡电阻的焊料掩模油墨; 及其固化物。 特别是一种感光性树脂组合物，其特征在于，含有（1）可溶于碱水溶液的聚氨酯树脂（A），在不存在催化剂的情况下通过氨基甲酸酯化得到的聚氨酯树脂，二异氰酸酯化合物（a），具有烯属不饱和的二醇化合物 其分子（b）中的基团和其分子中具有羧基的二醇化合物（c）任选地与在其分子（d）中不具有任何烯键式不饱和基团或羧基的二醇化合物一起使反应产物与环状 酸酐（e）; （2）光聚合引发剂（B）; 和（3）反应性交联剂（C）。

    Photosensitive resins, resin compositions and products of curing thereof
    10.
    发明授权
    Photosensitive resins, resin compositions and products of curing thereof 失效
    感光树脂，树脂组合物及其固化产物

    公开(公告)号：US07361450B2

    公开(公告)日：2008-04-22

    申请号：US10505600

    申请日：2003-02-25

    申请人： Hiroo Koyanagi ,  Koji Nakayama ,  Chie Umeyama ,  Yoshihiro Kawada ,  Minoru Yokoshima

    发明人： Hiroo Koyanagi ,  Koji Nakayama ,  Chie Umeyama ,  Yoshihiro Kawada ,  Minoru Yokoshima

    IPC分类号： G03C1/73 ,  G03F7/027 ,  G03F7/09 ,  G03F7/20

    CPC分类号： C09D167/07 ,  C08F290/06 ,  C08F290/061 ,  C08G63/668 ,  C08G63/91 ,  C08L67/07 ,  G02B6/138 ,  Y10S430/109 ,  Y10S430/117 ,  Y10S525/921

    摘要： A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.

    摘要翻译： 基本上由通过使多元醇（a）与四元酸二酐（b）的反应产物的聚酯（c）与具有烯键式不饱和基团的化合物（d）反应得到的产物的光敏树脂（A）和 分子中的环氧基; 通过使感光性树脂（A）与二 - 或三 - 碱性单酸酐（e）反应得到的碱溶性感光性树脂（AA） 通过将上述感光性树脂与稀释剂（XX），交联剂（B）和/或光聚合引发剂（C）并入而制备的感光性树脂组合物; 组合物的固化产物; 和配备这些产品的物品。 树脂和树脂组合物提供适合于形成光波导的固化物，加工性，透明性，显影性，密合性，耐焊接性等优异。