发明申请
- 专利标题： Wafer dicing method
- 专利标题（中）： 晶圆切片方法
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申请号： US11798503申请日： 2007-05-14
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公开(公告)号： US20080286946A1公开(公告)日： 2008-11-20
- 发明人: Chih-Hung Wu , Chieh Cheng , Kai-Sheng Chang , Kuan-Yu Chu
- 申请人： Chih-Hung Wu , Chieh Cheng , Kai-Sheng Chang , Kuan-Yu Chu
- 申请人地址： TW TAOYUAN
- 专利权人： ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH
- 当前专利权人： ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH
- 当前专利权人地址： TW TAOYUAN
- 主分类号： H01L21/304
- IPC分类号： H01L21/304
摘要：
A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.
公开/授权文献
- US07598157B2 Wafer dicing method 公开/授权日：2009-10-06
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