公开(公告)号：US06962438B2

公开(公告)日：2005-11-08

申请号：US10774430

申请日：2004-02-10

Applicant: Kuan-Yu Chu

Inventor： Kuan-Yu Chu

IPC: G01K13/02 ,  G01K1/08

CPC classification number: G01K13/02

Abstract: A temperature sensor temperature sensing tube comprised of a head section having an outer conoidal hem formed along the circumference at its lower extent, a neck section formed at the center, a passage disposed in the neck section, and a tube member having a hollow interior section that is contiguous with the passage and an aperture in its bottom section. The head section and the tube member are forged from a tubular blank into a one-piece, entirely unitary structural component, with the head section outer conoidal hem and neck section formed as extensions of the tube member.

Abstract translation: 一种温度传感器温度感测管，包括：头部，其具有沿着其下部周边的圆周形成的外部锥形折边，形成在中心的颈部，设置在颈部中的通道，以及具有中空的内部部分 其与通道邻接并且在其底部具有孔。 头部和管构件从管状坯料锻造成一体的，完全一体的结构部件，其中头部外部锥形下摆和颈部部分形成为管部件的延伸部。

公开(公告)号：US20150049263A1

公开(公告)日：2015-02-19

申请号：US14460333

申请日：2014-08-14

Applicant: Kuan-Yu Chu ,  Chen-Fu Huang ,  Chin-Pei Hwang ,  Ming-Wu Chen ,  Chun-Cheng Huang ,  Yu-Ching Wang

Inventor： Kuan-Yu Chu ,  Chen-Fu Huang ,  Chin-Pei Hwang ,  Ming-Wu Chen ,  Chun-Cheng Huang ,  Yu-Ching Wang

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  G06F2203/04107

Abstract: A touch display device including a touch panel, a protection layer, a conductive optical adhesive layer and a display panel is provided. The touch panel includes a substrate, pads, at least one grounding pad, a touch-sensing device, and at least one ESD protection line. The touch panel includes a pad area and an active area. The pads and the grounding pad are disposed on the substrate and located in the pad area. The touch-sensing device is disposed on the substrate and located in the active area. The ESD protection line is disposed on the substrate and located at a side of the active area. The protection layer including a first opening covers the touch panel and a portion of the pad area is exposed by the first opening. The conductive optical adhesive layer is disposed on the protection layer and electrically connected to the ESD protection circuit.

Abstract translation: 提供了包括触摸面板，保护层，导电光学粘合剂层和显示面板的触摸显示装置。 触摸面板包括基板，焊盘，至少一个接地焊盘，触摸感测装置以及至少一个ESD保护线。 触摸面板包括焊盘区域和有源区域。 焊盘和接地焊盘设置在基板上并且位于焊盘区域中。 触摸感测装置设置在基板上并且位于有源区域中。 ESD保护线设置在基板上并且位于有源区域的一侧。 包括第一开口的保护层覆盖触摸面板，并且焊盘区域的一部分被第一开口暴露。 导电光学粘合剂层设置在保护层上并电连接到ESD保护电路。

公开(公告)号：US07562922B2

公开(公告)日：2009-07-21

申请号：US11798504

申请日：2007-05-14

Applicant: Chih-Hung Wu ,  Hung-Sheng Chiu ,  Kai-Sheng Chang ,  Kuan-Yu Chu

Inventor： Chih-Hung Wu ,  Hung-Sheng Chiu ,  Kai-Sheng Chang ,  Kuan-Yu Chu

IPC: B25B9/02

CPC classification number: B25B9/02 ,  H01L21/68707 ,  Y10S294/902

Abstract: A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping. Hence, the present invention has a simple structure, a good practicality and a wide application.

Abstract translation: 根据本发明的晶片夹具总是牢固地夹紧晶片。 根据晶片尺寸，晶片夹具的支撑臂将被不同的替代。 此外，由于支撑臂的面积较大，所以提高了晶片的耐磨性和平滑性。 此外，晶片夹阻止晶片滑动。 因此，本发明结构简单，实用性好，应用广泛。

公开(公告)号：US07598157B2

公开(公告)日：2009-10-06

申请号：US11798503

申请日：2007-05-14

Applicant: Chih-Hung Wu ,  Chieh Cheng ,  Kai-Sheng Chang ,  Kuan-Yu Chu

Inventor： Chih-Hung Wu ,  Chieh Cheng ,  Kai-Sheng Chang ,  Kuan-Yu Chu

IPC: H01L21/00

CPC classification number: H01L21/78 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68735 ,  H01L21/68778 ,  H01L2221/68318 ,  H01L2221/68327

Abstract: A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.

Abstract translation: 堆叠在安装层上的晶片被安全地切割。 安装层具有部分对应于晶片上的芯片的孔。 因此，可以从安装带安全地移除在切割晶片之后获得的芯片。 可以减少使用的安装带的量。 生产成本也可以降低。

公开(公告)号：US20080286946A1

公开(公告)日：2008-11-20

申请号：US11798503

申请日：2007-05-14

Applicant: Chih-Hung Wu ,  Chieh Cheng ,  Kai-Sheng Chang ,  Kuan-Yu Chu

Inventor： Chih-Hung Wu ,  Chieh Cheng ,  Kai-Sheng Chang ,  Kuan-Yu Chu

IPC: H01L21/304

CPC classification number: H01L21/78 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68735 ,  H01L21/68778 ,  H01L2221/68318 ,  H01L2221/68327

Abstract: A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.

Abstract translation: 堆叠在安装层上的晶片被安全地切割。 安装层具有部分对应于晶片上的芯片的孔。 因此，可以从安装带安全地移除在切割晶片之后获得的芯片。 可以减少使用的安装带的量。 生产成本也可以降低。

公开(公告)号：US20080284082A1

公开(公告)日：2008-11-20

申请号：US11798504

申请日：2007-05-14

Applicant: Chih-Hung Wu ,  Hung-Sheng Chiu ,  Kai-Sheng Chang ,  Kuan-Yu Chu

Inventor： Chih-Hung Wu ,  Hung-Sheng Chiu ,  Kai-Sheng Chang ,  Kuan-Yu Chu

IPC: B25B5/16

CPC classification number: B25B9/02 ,  H01L21/68707 ,  Y10S294/902

Abstract: A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping. Hence, the present invention has a simple structure, a good practicality and a wide application

Abstract translation: 根据本发明的晶片夹具总是牢固地夹紧晶片。 根据晶片尺寸，晶片夹具的支撑臂将被不同的替代。 此外，由于支撑臂的面积较大，所以提高了晶片的耐磨性和平滑性。 此外，晶片夹阻止晶片滑动。 因此，本发明结构简单，实用性好，应用广泛

公开(公告)号：US20050172693A1

公开(公告)日：2005-08-11

申请号：US10774429

申请日：2004-02-10

Applicant: Kuan-Yu Chu

Inventor： Kuan-Yu Chu

IPC: B21D41/00 ,  B21D41/04

CPC classification number: B21D41/04 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49083 ,  Y10T29/49151 ,  Y10T29/49165 ,  Y10T29/49218 ,  Y10T83/0476 ,  Y10T83/0505 ,  Y10T83/051

Abstract: A temperature sensor temperature sensing tube and its fabrication method comprised of a step that provides for a tubular blank of an appropriate length, a step in which a curvilinear semifinished product of the tube member bottom section aperture is formed, a step in which a semifinished product of the neck base and the neck body is formed, a step in which a semifinished product of the neck base and the neck body is further formed, and a step in which a finished product having an outer conoidal hem and an inner conoidal hem is formed. Executing each step completes the fabrication of the temperature sensing tube.

Abstract translation: 一种温度传感器温度感测管及其制造方法，包括提供适当长度的管状坯料的步骤，其中形成管构件底部开口的曲线半成品的步骤，其中半成品 形成颈部基部和颈部主体的步骤，其中进一步形成颈部基部和颈部的半成品，并且形成具有外部锥形边缘和内部锥形边缘的成品的步骤 。 执行每个步骤完成温度传感管的制造。

公开(公告)号：US07363695B2

公开(公告)日：2008-04-29

申请号：US10774429

申请日：2004-02-10

Applicant: Kuan-Yu Chu

Inventor： Kuan-Yu Chu

IPC: G01R3/00

CPC classification number: B21D41/04 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49083 ,  Y10T29/49151 ,  Y10T29/49165 ,  Y10T29/49218 ,  Y10T83/0476 ,  Y10T83/0505 ,  Y10T83/051

Abstract: A temperature sensor temperature sensing tube and its fabrication method comprised of a step that provides for a tubular blank of an appropriate length, a step in which a curvilinear semifinished product of the tube member bottom section aperture is formed, a step in which a semifinished product of the neck base and the neck body is formed, a step in which a semifinished product of the neck base and the neck body is further formed, and a step in which a finished product having an outer conoidal hem and an inner conoidal hem is formed. Executing each step completes the fabrication of the temperature sensing tube.

Abstract translation: 一种温度传感器温度感测管及其制造方法，包括提供适当长度的管状坯料的步骤，其中形成管构件底部开口的曲线半成品的步骤，其中半成品 形成颈部基部和颈部主体的步骤，其中进一步形成颈部基部和颈部的半成品，并且形成具有外部锥形边缘和内部锥形边缘的成品的步骤 。 执行每个步骤完成温度传感管的制造。

公开(公告)号：US20150077654A1

公开(公告)日：2015-03-19

申请号：US14488290

申请日：2014-09-17

Applicant: Kuan-Yu Chu ,  Yu-Ching Wang ,  Yung-Hui Chang ,  Chin-Pei Hwang ,  Ming-Wu Chen

Inventor： Kuan-Yu Chu ,  Yu-Ching Wang ,  Yung-Hui Chang ,  Chin-Pei Hwang ,  Ming-Wu Chen

IPC: G06F1/16

CPC classification number: G06F1/169 ,  G06F3/0412 ,  G06F3/044 ,  Y10T428/24851

Abstract: A touch panel having a light transmitting area and a light shielding area adjacent to the light transmitting area is provided. The touch panel includes a cover plate, a first decoration layer, a touch-sensing element and a metal conductive layer. The first decoration layer is disposed on the cover plate and located in the light shielding area. The first decoration layer has at least one hollow area. The touch-sensing element is disposed on the cover plate and at least located in the light transmitting area. The metal conductive layer is disposed on the first decoration layer, located in the light shielding area and surrounds the touch-sensing element. A portion of the metal conductive layer surrounds the hollow area.

Abstract translation: 提供具有透光区域和与透光区域相邻的遮光区域的触摸面板。 触摸面板包括盖板，第一装饰层，触摸感测元件和金属导电层。 第一装饰层设置在盖板上并且位于遮光区域中。 第一装饰层具有至少一个中空区域。 触摸感测元件设置在盖板上并且至少位于透光区域中。 金属导电层设置在第一装饰层上，位于遮光区域中并且包围触摸感测元件。 金属导电层的一部分围绕中空区域。

公开(公告)号：US20140160708A1

公开(公告)日：2014-06-12

申请号：US14103850

申请日：2013-12-12

Applicant: Kuan-Yu Chu ,  Chen-Fu Huang ,  Chiu-Mei Liu ,  Ming-Wu Chen ,  Chin-Pei Hwang ,  Chun-Cheng Huang ,  Yu-Ching Wang ,  Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

Inventor： Kuan-Yu Chu ,  Chen-Fu Huang ,  Chiu-Mei Liu ,  Ming-Wu Chen ,  Chin-Pei Hwang ,  Chun-Cheng Huang ,  Yu-Ching Wang ,  Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

IPC: H02H9/02

CPC classification number: H02H9/02 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04107 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/117 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/09354 ,  H05K2201/09727 ,  H01L2924/00

Abstract: A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.

Abstract translation: 设置在基板上的引线结构。 衬底包括布置有器件的显示区域和设置有包括第一焊盘，第二焊盘，第一迹线和第二迹线的引线结构的周边区域。 第一条迹线连接到设备。 每个第一迹线具有连接在一起的第一直线部分和第一接合部分。 每个第一迹线通过第一接合部分电连接到第一焊盘之一。 第二迹线具有连接在一起的第二直线部分和第二接合部分。 第二迹线通过第二接合部电连接到第二焊盘。 第一直线部分的宽度小于第一接合部分的宽度，并且第二直线部分的宽度小于第二接合部分的宽度。