发明申请
US20080287008A1 Electronic device having molded resin case, and molding tool and method of manufacturing the same
审中-公开
具有模制树脂外壳的电子设备和成型工具及其制造方法
- 专利标题： Electronic device having molded resin case, and molding tool and method of manufacturing the same
- 专利标题（中）： 具有模制树脂外壳的电子设备和成型工具及其制造方法
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申请号： US12152206申请日： 2008-05-13
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公开(公告)号： US20080287008A1公开(公告)日： 2008-11-20
- 发明人: Tatsuya Watanabe , Masahiko Imoto , Yoshinari Goshima
- 申请人： Tatsuya Watanabe , Masahiko Imoto , Yoshinari Goshima
- 申请人地址： JP Kariya-city
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya-city
- 优先权： JP2007-133190 20070518
- 主分类号： H01R13/66
- IPC分类号： H01R13/66 ; B29C70/72
摘要：
An electronic device includes an electronic circuit section, a case, and a connector housing. The electronic circuit section includes a connector terminal. The case seals the electronic circuit section in such a manner that the connector terminal protrudes to an outside of the case. The connector housing is integrated with the case and has an approximately cylindrical shape to surround an outer circumference of the connector terminal. The case and the connector housing are made of resin with a molding tool by filling resin into a case cavity and a connector-housing cavity of the molding tool in a state where the electronic circuit section is held by a holding portion of the molding tool.
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