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公开(公告)号：US07905131B2
公开(公告)日：2011-03-15
申请号：US12214159
申请日：2008-06-17
IPC分类号： G01M3/26
CPC分类号： H01L21/565 , B29C45/0025 , B29C45/14639 , B29C45/77 , B29C2945/76006 , B29C2945/7609 , B29C2945/76163 , B29C2945/76187 , B29C2945/76257 , B29C2945/76381 , B29C2945/76943 , H01L23/315 , H01L2924/0002 , H01L2924/19041 , H01L2924/00
摘要： A resin leak detector includes a pressure sensor element and a leak determination unit. The pressure sensor element detects a pressure in a case cavity. That is, when resin leaks into a space between an upper circuit case and a lower circuit case, the pressure in the case cavity decreases temporarily. The decrease of the pressure in the case cavity is detected by the pressure sensor element based on comparison between a detected pressure and a predetermined lower limit. The resin leak into the upper and lower circuit case is detected without cutting an outer case of an electronic device such as an acceleration sensor or the like.
摘要翻译： 树脂泄漏检测器包括压力传感器元件和泄漏确定单元。 压力传感器元件检测壳体腔中的压力。 也就是说，当树脂泄漏到上部电路壳体和下部电路壳体之间的空间中时，壳体空腔中的压力暂时减小。 基于检测压力和预定下限之间的比较，通过压力传感器元件来检测壳体腔中的压力的降低。 在不切断加速度传感器等的电子装置的外壳的情况下，检测到树脂泄漏到上下电路壳体中。
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2.发明授权Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case 有权制造具有树脂模制外壳的电子装置和用于形成树脂模制壳体的模制工具的方法公开(公告)号：US07776247B2
公开(公告)日：2010-08-17
申请号：US12156518
申请日：2008-06-02
IPC分类号： B29C45/14
CPC分类号： H01L21/565 , B29C45/0046 , B29C45/14639 , B29C45/2708 , H01L2924/0002 , H01L2924/00
摘要： In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.
摘要翻译： 在制造电子设备的方法中，电子元件设置在与连接器端子电耦合的布线板上，布线板的第一表面被第一壳体元件覆盖，并且布线板的第二表面是 覆盖有第二壳体元件以形成电子电路部分，电子电路部分设置在模制工具的壳体腔中，并且将树脂填充到壳体腔中以形成树脂模制壳体，同时保持 将第一壳体元件推向布线板并随时间变化的第一压力基本上等于将第二壳体元件推向布线板并随时间变化的第二压力。
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3.发明申请Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case 有权制造具有树脂模制外壳的电子装置和用于形成树脂模制壳体的模制工具的方法公开(公告)号：US20080296796A1
公开(公告)日：2008-12-04
申请号：US12156518
申请日：2008-06-02
IPC分类号： B29C45/00
CPC分类号： H01L21/565 , B29C45/0046 , B29C45/14639 , B29C45/2708 , H01L2924/0002 , H01L2924/00
摘要： In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.
摘要翻译： 在制造电子设备的方法中，电子元件设置在与连接器端子电耦合的布线板上，布线板的第一表面被第一壳体元件覆盖，并且布线板的第二表面是 覆盖有第二壳体元件以形成电子电路部分，电子电路部分设置在模制工具的壳体腔中，并且将树脂填充到壳体腔中以形成树脂模制壳体，同时保持 将第一壳体元件推向布线板并随时间变化的第一压力基本上等于将第二壳体元件推向布线板并随时间变化的第二压力。
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4.发明申请Electronic device having molded resin case, and molding tool and method of manufacturing the same 审中-公开具有模制树脂外壳的电子设备和成型工具及其制造方法公开(公告)号：US20080287008A1
公开(公告)日：2008-11-20
申请号：US12152206
申请日：2008-05-13
CPC分类号： G01P1/023 , B29C33/123 , G01P15/125 , H01L21/565 , H01L2924/0002 , H01R43/24 , H05K5/0034 , H05K5/0078 , H05K5/065 , H01L2924/00
摘要： An electronic device includes an electronic circuit section, a case, and a connector housing. The electronic circuit section includes a connector terminal. The case seals the electronic circuit section in such a manner that the connector terminal protrudes to an outside of the case. The connector housing is integrated with the case and has an approximately cylindrical shape to surround an outer circumference of the connector terminal. The case and the connector housing are made of resin with a molding tool by filling resin into a case cavity and a connector-housing cavity of the molding tool in a state where the electronic circuit section is held by a holding portion of the molding tool.
摘要翻译： 电子设备包括电子电路部分，壳体和连接器壳体。 电子电路部分包括连接器端子。 壳体以使得连接器端子突出到壳体的外部的方式密封电子电路部分。 连接器壳体与壳体一体化并且具有围绕连接器端子的外圆周的大致圆柱形形状。 壳体和连接器壳体由具有模制工具的树脂制成，其通过在模制工具的保持部分保持电子电路部分的状态下将树脂填充到模腔中的壳体空腔和连接器壳体腔中。
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公开(公告)号：US20080314121A1
公开(公告)日：2008-12-25
申请号：US12214159
申请日：2008-06-17
IPC分类号： G01M3/04
CPC分类号： H01L21/565 , B29C45/0025 , B29C45/14639 , B29C45/77 , B29C2945/76006 , B29C2945/7609 , B29C2945/76163 , B29C2945/76187 , B29C2945/76257 , B29C2945/76381 , B29C2945/76943 , H01L23/315 , H01L2924/0002 , H01L2924/19041 , H01L2924/00
摘要： A resin leak detector includes a pressure sensor element and a leak determination unit. The pressure sensor element detects a pressure in a case cavity. That is, when resin leaks into a space between an upper circuit case and a lower circuit case, the pressure in the case cavity decreases temporarily. The decrease of the pressure in the case cavity is detected by the pressure sensor element based on comparison between a detected pressure and a predetermined lower limit. The resin leak into the upper and lower circuit case is detected without cutting an outer case of an electronic device such as an acceleration sensor or the like.
摘要翻译： 树脂泄漏检测器包括压力传感器元件和泄漏确定单元。 压力传感器元件检测壳体腔中的压力。 也就是说，当树脂泄漏到上部电路壳体和下部电路壳体之间的空间中时，壳体空腔中的压力暂时减小。 基于检测压力和预定下限之间的比较，通过压力传感器元件来检测壳体腔中的压力的降低。 在不切断加速度传感器等的电子装置的外壳的情况下，检测到树脂泄漏到上下电路壳体中。
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