Invention Application
US20080290440A1 Photodiode for Image Sensor and Method of Manufacturing the Same 审中-公开
用于图像传感器的光电二极管及其制造方法

  • Patent Title: Photodiode for Image Sensor and Method of Manufacturing the Same
  • Patent Title (中): 用于图像传感器的光电二极管及其制造方法
  • Application No.: US12097469
    Application Date: 2006-12-04
  • Publication No.: US20080290440A1
    Publication Date: 2008-11-27
  • Inventor: Byoung Su Lee
  • Applicant: Byoung Su Lee
  • Priority: KR10-2005-0131324 20051228
  • International Application: PCT/KR2006/005167 WO 20061204
  • Main IPC: H01L31/0224
  • IPC: H01L31/0224
Photodiode for Image Sensor and Method of Manufacturing the Same
Abstract:
A photodiode for an image sensor capable of reducing reflection of light incident onto the photodiode and effectively absorbing transmitted light and a method of manufacturing the same are provided. In the photodiode for the image sensor, a silicon concavo-convex surface with a nano-thickness is formed by forming silicon oxide (SiO, x=0.5-1.5) layer on a silicon substrate and treating the silicon oxide layer with heat. A photodiode region is formed under the silicon layer having convexes and concaves. In this case, light absorptance increases because light reflected on the silicon concavo-convex surface is reincident onto another convex or concave. Therefore, an effective depth of the photodiode is larger than that of a planar photodiode, and accordingly, quantum efficiency of the photodiode increases.
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