发明申请
- 专利标题: Microwave Conducting Arrangement
- 专利标题(中): 微波导电布置
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申请号: US10586561申请日: 2005-01-19
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公开(公告)号: US20080297285A1公开(公告)日: 2008-12-04
- 发明人: Qi Chen , Klaus Feisst , Eric Bergmann , Manfred Hammer
- 申请人: Qi Chen , Klaus Feisst , Eric Bergmann , Manfred Hammer
- 申请人地址: DE Maulburg
- 专利权人: Endress + Hauser GmbH + Co. KG
- 当前专利权人: Endress + Hauser GmbH + Co. KG
- 当前专利权人地址: DE Maulburg
- 优先权: DE102004003010.3 20040120
- 国际申请: PCT/EP2005/050211 WO 20050119
- 主分类号: H01P3/14
- IPC分类号: H01P3/14 ; H01P3/123 ; H01P11/00 ; H01Q13/02
摘要:
In order to provide a microwave-conducting arrangement, which is relatively easy, and thus cost-favorable, to fabricate, and which is suited also for complex structures and geometries, one or more electrically conductive layers are provided which are applied on a non-conductive body having a surface of any shape. A metallizing provided for such purpose on the surface of the body is, for example, produced by a vapor-deposition process, by means of a flame-spraying process, or by means of a chemical metallizing.
公开/授权文献
- US3230131A Allyl resin laminates 公开/授权日:1966-01-18
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