发明申请
- 专利标题: METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
- 专利标题(中): 制造半导体发光元件的方法
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申请号: US12127286申请日: 2008-05-27
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公开(公告)号: US20080299694A1公开(公告)日: 2008-12-04
- 发明人: Katsushi AKITA , Hitoshi Kasai , Yoshiki Miura , Kensaku Motoki
- 申请人: Katsushi AKITA , Hitoshi Kasai , Yoshiki Miura , Kensaku Motoki
- 申请人地址: JP Osaka-shi
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka-shi
- 优先权: JPP2007-143710 20070530
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
In a semiconductor laser manufacturing method, a GaN single-crystal substrate is formed by slicing a GaN bulk crystal, grown on a c-plane, parallel to an a-plane which is perpendicular to the c-plane. In this substrate, crystal defects extending parallel to the c-axis direction do not readily exert an influence, and degradation of element characteristics due to crystal defects can be suppressed. Further, because the a-plane is a nonpolar plane, improved light emission efficiency and longer wavelengths can be achieved compared with the c-plane, which is a polar plane. Hence a semiconductor laser manufacturing method of this invention enables further improvement of the element characteristics of the semiconductor laser to be fabricated.
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