发明申请
- 专利标题: PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD
- 专利标题(中): 印刷线路板和制造印刷电路板的方法
-
申请号: US12120076申请日: 2008-05-13
-
公开(公告)号: US20080302560A1公开(公告)日: 2008-12-11
- 发明人: Katsuhiko Tanno , Youichirou Kawamura
- 申请人: Katsuhiko Tanno , Youichirou Kawamura
- 申请人地址: JP Ogaki-shi
- 专利权人: IBIDEN CO., LTD
- 当前专利权人: IBIDEN CO., LTD
- 当前专利权人地址: JP Ogaki-shi
- 优先权: JP2006-019065 20060127
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; B23K31/00 ; H01R9/00
摘要:
A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.