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1.发明授权公开(公告)号：US08087164B2
公开(公告)日：2012-01-03
申请号：US12120076
申请日：2008-05-13
IPC分类号： H01K3/10
CPC分类号： H05K3/3457 , H01L21/4853 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H05K3/3436 , H05K3/3478 , H05K2201/094 , H05K2203/0278 , H05K2203/041 , H05K2203/043 , Y10T29/49121 , Y10T29/49142 , Y10T29/49144 , Y10T29/49149 , Y10T29/49167 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.
摘要翻译： 制造具有焊料凸块的印刷线路板的方法包括形成具有小的和大的孔的阻焊层，暴露印刷线路板的各自的导电焊盘，使用具有 与阻焊层的孔相对应的孔径区域，从小孔中的焊球形成具有第一高度的第一凸起，以及从大孔中的焊球形成具有第二高度的第二凸起， 第一高度大于第二高度，并且按压第一凸起的顶部，使得第一高度变得与第二高度基本相同。 多层印刷布线板包括具有不同尺寸的孔的阻焊层和具有基本相等体积但高度差不大于10μm的焊料凸块。
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公开(公告)号：US20090120680A1
公开(公告)日：2009-05-14
申请号：US12093436
申请日：2008-05-12
CPC分类号： H05K3/3478 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H05K3/3452 , H05K2201/0191 , H05K2203/041 , H05K2203/043 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the solder resist layer has a depth D, from the solder resist layer to the exposed connection pad, of from 3 μm to 18 μm. The method also includes loading a solder ball into each of the at least one opening in the solder resist layer, and forming a bump on the exposed connection pad by heating the solder ball to a reflow temperature.
摘要翻译： 制造具有至少一个焊料凸块的印刷电路板的方法包括在导体层上形成阻焊层。 阻焊层具有暴露导体层的连接焊盘的至少一个开口，并且阻焊层中的至少一个开口具有从3μm的阻焊层到暴露的连接焊盘的深度D 到18岁 该方法还包括将焊球加载到阻焊层中的至少一个开口中的每一个中，以及通过将焊球加热到回流温度在暴露的连接焊盘上形成凸块。
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公开(公告)号：US08091766B2
公开(公告)日：2012-01-10
申请号：US12180830
申请日：2008-07-28
CPC分类号： H05K3/3478 , B23K3/0623 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/041 , H05K2203/0557 , H05K2203/082 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board, one or more cylinder members positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member, and a conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device.
摘要翻译： 一种用于将焊球加载到印刷线路板的焊盘上的焊球加载装置，包括：保持装置，用于保持具有焊盘的印刷线路板，并且保持具有对应于印刷线路板的焊盘的开口的球形阵列掩模，一个或多个 气缸构件定位在保持装置上方，使得气缸构件的开口部分面向保持装置，气缸构件通过吸入空气通过气缸构件的开口部分而在气缸构件下收集球阵列的表面上的焊球 以及用于相对于圆筒部件移动球形阵列掩模和印刷线路板的传送机构，使得聚集在圆筒部件的开口部分下方的焊球可以通过所述印刷线路板的开口装载到印刷线路板的焊盘上 球形阵列掩模由保持装置保持。
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4.发明授权公开(公告)号：US09480170B2
公开(公告)日：2016-10-25
申请号：US13274897
申请日：2011-10-17
CPC分类号： H05K3/3457 , H01L21/4853 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H05K3/3436 , H05K3/3478 , H05K2201/094 , H05K2203/0278 , H05K2203/041 , H05K2203/043 , Y10T29/49121 , Y10T29/49142 , Y10T29/49144 , Y10T29/49149 , Y10T29/49167 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.
摘要翻译： 制造具有焊料凸块的印刷线路板的方法包括形成具有小的和大的孔的阻焊层，暴露印刷线路板的各自的导电焊盘，使用具有 与阻焊层的孔相对应的孔径区域，从小孔中的焊球形成具有第一高度的第一凸起，以及从大孔中的焊球形成具有第二高度的第二凸起， 第一高度大于第二高度，并且按压第一凸起的顶部，使得第一高度变得与第二高度基本相同。 多层印刷布线板包括具有不同尺寸的孔的阻焊层和具有基本相等体积但高度差不大于10μm的焊料凸块。
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公开(公告)号：US20120067938A1
公开(公告)日：2012-03-22
申请号：US13271531
申请日：2011-10-12
IPC分类号： B23K3/06
CPC分类号： H05K3/3478 , B23K3/0623 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/041 , H05K2203/0557 , H05K2203/082 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having openings that correspond to the pads, one or more cylinder members is positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion. A conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the board through the openings of the mask held by the holding device.
摘要翻译： 用于将焊球加载到印刷线路板的焊盘上的焊球加载装置包括：保持装置，用于保持具有焊盘的印刷线路板，并保持具有对应于焊盘的开口的球形阵列掩模，一个或多个气缸构件定位在 所述保持装置使得所述圆筒构件的开口部面向所述保持装置，所述圆筒构件通过从所述开口部抽吸空气而将所述球形阵列的表面上的焊球收集在所述圆筒构件的下方。 一种传送机构，用于使球阵列掩模和印刷线路板相对于圆筒部件移动，使得聚集在圆筒部件的开口部分下方的焊球能够通过由所述圆筒部件保持的面罩的开口装载到板的焊盘上 保持装置。
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公开(公告)号：US08083123B2
公开(公告)日：2011-12-27
申请号：US12093436
申请日：2008-05-12
CPC分类号： H05K3/3478 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H05K3/3452 , H05K2201/0191 , H05K2203/041 , H05K2203/043 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the solder resist layer has a depth D, from the solder resist layer to the exposed connection pad, of from 3 μm to 18 μm. The method also includes loading a solder ball into each of the at least one opening in the solder resist layer, and forming a bump on the exposed connection pad by heating the solder ball to a reflow temperature.
摘要翻译： 制造具有至少一个焊料凸块的印刷电路板的方法包括在导体层上形成阻焊层。 阻焊层具有暴露导体层的连接焊盘的至少一个开口，并且阻焊层中的至少一个开口具有从阻焊层到暴露的连接焊盘的3μm的深度D 至18μm。 该方法还包括将焊球加载到阻焊层中的至少一个开口中的每一个中，以及通过将焊球加热到回流温度在暴露的连接焊盘上形成凸块。
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7.发明申请公开(公告)号：US20080302560A1
公开(公告)日：2008-12-11
申请号：US12120076
申请日：2008-05-13
CPC分类号： H05K3/3457 , H01L21/4853 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H05K3/3436 , H05K3/3478 , H05K2201/094 , H05K2203/0278 , H05K2203/041 , H05K2203/043 , Y10T29/49121 , Y10T29/49142 , Y10T29/49144 , Y10T29/49149 , Y10T29/49167 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.
摘要翻译： 制造具有焊料凸块的印刷线路板的方法包括形成具有小的和大的孔的阻焊层，暴露印刷线路板的各自的导电焊盘，使用具有 与阻焊层的孔相对应的孔径区域，从小孔中的焊球形成具有第一高度的第一凸起，以及从大孔中的焊球形成具有第二高度的第二凸起， 第一高度大于第二高度，并且按压第一凸起的顶部，使得第一高度变得与第二高度基本相同。 多层印刷线路板包括具有不同尺寸的孔径的阻焊层和具有基本相等体积但高度差不大于10um的焊料凸块。
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公开(公告)号：US08448838B2
公开(公告)日：2013-05-28
申请号：US13315972
申请日：2011-12-09
申请人： Shigeki Sawa , Katsuhiko Tanno , Osamu Kimura , Koji Kuribayashi
发明人： Shigeki Sawa , Katsuhiko Tanno , Osamu Kimura , Koji Kuribayashi
CPC分类号： H05K3/3478 , B23K3/0623 , B23K3/0692 , B23K2101/36 , H05K3/3489 , H05K2203/041 , H05K2203/0485 , H05K2203/0557
摘要： A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.
摘要翻译： 能够将焊球牢固地装载在连接焊盘上的焊球加载方法包括在印刷电路板的每个连接焊盘组上施加焊剂，焊剂不会施加到间隔件和印刷电路板之间的接触部分，以保持焊剂附着到 间隔物。 由于焊剂没有附着到间隔物上，当掩模与印刷电路板分离时，印刷电路板不需要颠倒，并且使阻焊层70的损坏最小化。 此外，通过使用间隔件使焊球的高度和掩模的上表面相等，使得可以将焊球牢固地加载在电极焊盘上，每个连接焊盘用一个焊球，并且降低概率 该焊球没有被加载，或者多个焊球被加载到单个连接焊盘上。
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公开(公告)号：US07823762B2
公开(公告)日：2010-11-02
申请号：US11528539
申请日：2006-09-28
申请人： Yoichiro Kawamura , Katsuhiko Tanno , Masanori Iriyama , Sho Akai
发明人： Yoichiro Kawamura , Katsuhiko Tanno , Masanori Iriyama , Sho Akai
IPC分类号： B23K31/12
CPC分类号： H05K3/3478 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2924/00014 , H01L2924/15174 , H05K1/0269 , H05K3/225 , H05K2203/041 , H05K2203/043 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.
摘要翻译： 在具有小高度的凸块上加载焊球（图5（B）），并且通过用激光加热来熔化焊球来增强凸块的高度（图5（C））。 因此，凸起的高度在所要求的允许范围内被调整。 由于当低凸起的高度增强时凸起不会被加热而消除，印刷电路板不会受到局部的热历史，从而增强印刷电路板的凸块的可靠性。
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公开(公告)号：US20100155129A1
公开(公告)日：2010-06-24
申请号：US12713274
申请日：2010-02-26
CPC分类号： H05K3/3478 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/16235 , H01L2224/81192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/3452 , H05K2201/0191 , H05K2201/099 , H05K2203/041 , H05K2203/0557 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less.
摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，形成在所述布线基板的表面上的阻焊层，覆盖所述至少一个导体电路，形成在所述至少一个导体电路的一部分上的导体焊盘 从设置在用于安装电子部件的阻焊层中的各个开口露出，以及形成在各个导体焊盘上的焊料凸块。 通过使窄阻抗层的高度H与焊锡凸块的比例（H / D）在开口直径大约0.55至1.0左右，在窄间距结构下，在距离 设置在阻焊层上的开口约为200μm以下。
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