发明申请
US20080305577A1 METHOD OF MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL
失效
在半导体衬底面板上最小化KERF宽度的方法
- 专利标题： METHOD OF MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL
- 专利标题（中）： 在半导体衬底面板上最小化KERF宽度的方法
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申请号： US11760385申请日： 2007-06-08
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公开(公告)号： US20080305577A1公开(公告)日： 2008-12-11
- 发明人: Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
- 申请人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.