发明申请
- 专利标题: CPU Heat Sink Mounting Method And Apparatus
- 专利标题(中): CPU散热器安装方法和装置
-
申请号: US11764424申请日: 2007-06-18
-
公开(公告)号: US20080310118A1公开(公告)日: 2008-12-18
- 发明人: Brandon Joel Brocklesby , Juan Manuel Gonzalez , Laurent Andrew Regimbal
- 申请人: Brandon Joel Brocklesby , Juan Manuel Gonzalez , Laurent Andrew Regimbal
- 申请人地址: US TX Round Rock
- 专利权人: DELL PRODUCTS L.P.
- 当前专利权人: DELL PRODUCTS L.P.
- 当前专利权人地址: US TX Round Rock
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A system and method for mounting a heat sink associated with an electronics component are disclosed. The disclosure provides a method including connecting a CPU support bracket to a board using one or more support bracket connectors, mounting a CPU to the CPU support bracket, and mounting a heat sink assembly to the CPU support bracket using one or more heat sink connectors configured to mate with the one or more support bracket connectors.The disclosure also provides a method for mounting a heat sink assembly associated with a CPU, including removing one or more socket screws installed at one or more corners of a socket disposed in a board, installing one or more support bracket connectors configured to mate with respective holes in the board, and mounting a heat sink assembly to the support bracket connectors using one or more heat sink connectors configured to mate with the one or more support bracket connectors.The disclosure also provides a system for mounting an electronic component and associated heat sink to a board, including a support bracket operable to retain an electronic component and provide at least one electrical connection between a board and the electronic component, a support bracket connector configured to releasably connect the support bracket to the board, and a heat sink connector configured to releasably connect a heat sink with the support bracket connector.
信息查询