发明申请
US20090004805A1 Damage Implantation of a Cap Layer 有权
盖层的损伤植入

Damage Implantation of a Cap Layer
摘要:
A method for fabricating a transistor on a semiconductor wafer includes providing a partial transistor containing a gate stack, extension regions, and source/drain sidewalls. The method also includes performing a source/drain implant of the semiconductor wafer, forming a cap layer over the semiconductor wafer, and performing a source/drain anneal. In addition, the method includes performing a damage implant of the cap layer and removing the cap layer over the semiconductor wafer.
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