发明申请
- 专利标题: Damage Implantation of a Cap Layer
- 专利标题(中): 盖层的损伤植入
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申请号: US11771269申请日: 2007-06-29
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公开(公告)号: US20090004805A1公开(公告)日: 2009-01-01
- 发明人: Mahalingam Nandakumar , Wayne Bather , Narendra Singh Mehta
- 申请人: Mahalingam Nandakumar , Wayne Bather , Narendra Singh Mehta
- 申请人地址: US TX Dallas
- 专利权人: TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人: TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址: US TX Dallas
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L23/58
摘要:
A method for fabricating a transistor on a semiconductor wafer includes providing a partial transistor containing a gate stack, extension regions, and source/drain sidewalls. The method also includes performing a source/drain implant of the semiconductor wafer, forming a cap layer over the semiconductor wafer, and performing a source/drain anneal. In addition, the method includes performing a damage implant of the cap layer and removing the cap layer over the semiconductor wafer.
公开/授权文献
- US08859377B2 Damage implantation of a cap layer 公开/授权日:2014-10-14
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