发明申请
- 专利标题: Test socket
- 专利标题(中): 测试插座
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申请号: US12214932申请日: 2008-06-24
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公开(公告)号: US20090009204A1公开(公告)日: 2009-01-08
- 发明人: Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
- 申请人: Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co. Ltd.
- 当前专利权人: Samsung Electronics Co. Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2007-0067341 20070705
- 主分类号: G01R31/02
- IPC分类号: G01R31/02
摘要:
A test socket in accordance with one aspect of the present invention includes a socket body, a thermoelectric element and a heat transfer member. The socket body receives an object. The thermoelectric element is arranged in the socket body to emit heat and absorb heat in accordance with current directions. The heat transfer member is arranged between the object and the thermoelectric element to transfer a heat generated from the object to the thermoelectric element. Thus, the object may be directly provided with a desired test temperature using the thermoelectric element so that the desired test temperature may be set rapidly and accurately. Further, the heat transfer member interposed between the object and the thermoelectric element may quickly dissipate the heat in the object.
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